Posifa Technologies today introduced its new PAV5000 series MEMS anemometer sensor.
ASU-led Southwest Advanced Prototyping Hub Awarded $21.3M for Second Year of Funding for Microelectronics Projects
The Southwest Advanced Prototyping (SWAP) Hub, led by Arizona State University, has been awarded $21.3 million in Year 2 funding under the CHIPS and Science Act to continue its work advancing the rebirth of America’s microelectronics industry.
Ex Arm CTO Takes Chair Role at Optalysys
Optalysys, a company enabling the future of secure AI, backed by the Lingotto Investment Management LLP, imec.xpand, & Northern Gritstone, has appointed Dipesh Patel as Chair of its Board.
Selecting an MES Migration Strategy for Semiconductor Process Optimization
Migrating to a new MES platform can lower the total cost of ownership of automation and production assets, increase efficiency, revenue, and ultimately, profitability, safety and environmental sustainability.
How Silicon Carbide Semiconductors Are Conquering E-mobility
Bosch has tailored its semiconductor development to the demands of the automotive industry.
Silicon Industry Veteran Oreste Donzella Joins Sondrel Board as Non-Executive Director
Sondrel, a provider of ultra-complex custom chips, has announced that industry veteran, Oreste Donzella will join its board as a Non-Executive Director (NED) on January 1, 2025.
IBM Brings the Speed of Light to the Generative AI Era with Optics Breakthrough
New co-packaged optics innovation could replace electrical interconnects in data centers to offer significant improvements in speed and energy efficiency for AI and other computing applications.
Jeff Wilson of IBM Wins Si2 Pinnacle Award
Jeff Wilson, a software engineer in the IBM EDA development organization, has been honored with the quarterly Silicon Integration Initiative Pinnacle Award which recognizes volunteers for their professional contributions to Si2 programs.
Breakthrough Brings Body-Heat Powered Wearable Devices Closer to Reality
A QUT-led research team has developed an ultra-thin, flexible film that could power next-generation wearable devices using body heat, eliminating the need for batteries.
Semi-damascene Metallization: Inflection Point in Back-end-of-line Processing?
When used in combination with a patternable metal such as Ru, semi-damascene promises to be RC, area, cost and power efficient – offering an interconnect scaling path.
