Ansys has been recognized by TSMC as a recipient of four TSMC Open Innovation Platform (OIP) Partner of the year awards for 2023.
NexPoint Launches NexPoint Semiconductor Manufacturing DST Offering
NexPoint, an alternative investment firm with $14.4 billion in assets under management, today announced the launch of NexPoint Semiconductor Manufacturing DST.
Samsung Electronics Holds Memory Tech Day 2023 Unveiling New Innovations To Lead the Hyperscale AI Era
Samsung Electronics Co., Ltd. today held its annual Memory Tech Day, showcasing industry-first innovations and new memory products to accelerate technological advancements across future applications — including the cloud, edge devices and automotive vehicles.
Cadence Wins Four 2023 TSMC OIP Partner of the Year Awards
Cadence Design Systems, Inc. today announced that it has won four Open Innovation Platform (OIP) Partner of the Year awards from TSMC for its EDA and IP design solutions.
ventureLAB and Intel Sign Formal Collaboration for 2024
ventureLAB’s President and CEO, Hugh Chow, welcomed Denis Gaudreault, Country Manager at Intel Canada, global leader in design and manufacturing of essential technologies in the smart world, to its space.
Micron Low-Power Memory Solution Boosts Mixed and Virtual Reality Experiences on Snapdragon XR2 Gen 2
Micron Technology, Inc. announced today that its low-power double data rate 5X (LPDDR5X) DRAM and Universal Flash Storage (UFS) 3.1 embedded solutions are now qualified on Qualcomm Technologies’ latest extended reality (XR) platform, Snapdragon XR2 Gen 2 Platform.
Omdia: Amid the Struggling Market Conditions, Low-Priced Notebook Display Demand Stays Firm
New research from Omdia’s Notebook and tablet display & OEM Intelligence Service has found that global notebook PC panel shipment is estimated to reach 188.5 million units in 2023 and down by 13% YoY, having declined for two consecutive years since 2021.
Micron Low-Power Memory Solution Boosts Mixed and Virtual Reality Experiences on Snapdragon XR2 Gen 2
Micron Technology, Inc. announced today that its low-power double data rate 5X (LPDDR5X) DRAM and Universal Flash Storage (UFS) 3.1 embedded solutions are now qualified on Qualcomm Technologies’ latest extended reality (XR) platform, Snapdragon XR2 Gen 2 Platform.
ROHM’s New Five-Model Lineup of Low ON-Resistance 100V Dual MOSFETs
Lower power consumption and smaller size of fan motors applied in communication base stations and industrial equipment with 5.0mm × 6.0mm and 3.3mm × 3.3mm sizes.
New Institute Accelerates Future of Microelectronic System Integration, Advanced Packaging
Purdue collaborates with Cadence, imec, SRC, Osaka University to bolster rapid technology development in U.S.
