Multiferroics could be the key to ultralow-energy computing.
SiLC Technologies Advances Machine Vision, Bridging the AI Gap with Bionic Vision
In a world increasingly driven by artificial intelligence (AI), the need for machines to perceive and understand their surroundings in the same way as humans has never been more pressing.
ELES and proteanTecs Partner to Enhance Reliability Testing with Deep Data Analytics
Collaboration enables SoC manufacturers to improve their qualification envelope to achieve lifetime reliability, shorten their root cause analysis time, and reduce operational costs.
Presto Engineering Announces its Collaboration with Nokia as Part of France 2030 Investment Plan
Presto Engineering, a recognized expert in ASIC design and semiconductor engineering and production services, announced its collaboration with Nokia for the industrialization of new equipment designed to build the foundations of the next generation of microwave links.
SONOTEC and Its Partner S3 Alliance with Joint Booth Together at SEMICON Europa
From November 14 – 17, 2023, the European semiconductor industry meets in Munich at SEMICON Europa, a trade show for the semiconductor market.
G+D and Sony Semiconductor Israel Launch First Solution for Remote SIM Provisioning of iSIMs
Giesecke+Devrient (G+D) is playing a key role in shaping this development and, together with Sony Semiconductor Israel (Sony), is launching the first commercial iSIM solution that supports remote SIM provisioning.
eBeam Initiative Survey Reports Semiconductor Industry Luminaries Are Confident in High-NA EUV and Curvilinear Photomasks
Results of 12th annual Luminaries survey to be presented at live event held during SPIE Photomask Technology + EUV Lithography Conference.
Renesas Partners with EdgeCortix to Streamline AI/ML Development
Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, today announced a strategic partnership with EdgeCortix, a provider of energy efficient, Artificial Intelligence (AI) processing solutions at the edge.
Bruker Introduces Next-Generation Nanomechanical Test System
At the annual Materials Science and Technology (MS&T23) conference, Bruker Corporation today announced the release of the Hysitron TI 990 TriboIndenter, which brings superior levels of performance, automation, and productivity to nanomechanical testing.
SigmaSense Appoints Semiconductor Industry Veteran David French as CEO
SigmaSense, an emerging leader in DSP-based sensing systems, announced today that it has recruited veteran semiconductor industry executive David French as Chief Executive Officer to drive the next phase of growth for SigmaSense’s digital sensing products for real-world AI.
