Archer Materials Limited, a semiconductor company advancing the quantum computing and medical diagnostics industries, has developed a next generation biochip fabrication to better detect and control disease samples on a single graphene field effect transistor design.
Draper Joins Intel Foundry Services (IFS) Accelerator USMAG Alliance
Draper today announced that it has joined the Intel Foundry Services (IFS) U.S. Military, Aerospace and Government (USMAG) Alliance to support mutual customers with the domestic development and delivery of trusted solutions for national security applications.
TechSearch International, Inc. Examines Advanced Packaging’s Growth in AI
TechSearch International’s latest analysis examines demand for packages used in AI.
ASU-TSMC Partnership Will Focus on Student Support, Recruitment, Faculty Research
Arizona State University and the Taiwan Semiconductor Manufacturing Company (TSMC) today announced a partnership agreement focused on student support, training and recruitment, and faculty work projects and research that will deepen the existing relationship between ASU and the world’s leading manufacturer of semiconductor chips.
SIA Applauds Senate Passage of CHIPS Permitting Legislation
The amendment will maximize the impact of the CHIPS and Science Act by streamlining federal reviews for chip manufacturing projects while keeping environmental protections in place.
Mitsubishi Electric Buys Stake in Novel Crystal Technology to Accelerate Development of Gallium-oxide Power Semiconductors
Advanced semiconductors expected to offer superior energy savings in support of decarbonization.
SkyWater Florida and BRIDG Announce Installation of Nordson’s Leading C-SAM System to Enhance Metrology Capabilities at the Center for Neovation
The new tool will be utilized by SkyWater Florida to enhance onsite metrology capabilities for advanced packaging and heterogeneous integration technology.
AMD Announces Plan to Invest Approximately $400 Million Over the Next Five Years to Expand Operations in India
Investment expected to create largest AMD design center with addition of approximately 3,000 engineering roles and new Bangalore campus opening before end of 2023.
NEO Semiconductor to Present Its Ground-Breaking 3D NAND and 3D DRAM Architectures in Keynote Address at Flash Memory Summit 2023
NEO Semiconductor, a developer of innovative technologies for 3D NAND flash and DRAM memory, today announced its participation at Flash Memory Summit 2023, taking place in person in Santa Clara, California, on August 8-10.
Insight Global Announces Formal Division to Address Semiconductor Workforce Challenges
National staffing company building new path forward to fill talent gaps for rapidly expanding industry.
