SK hynix Inc. announced today that it has been awarded the ISO 37301 compliance management system and ISO 37001 anti-bribery management system certifications issued by the British Standards Institute (BSI).
Samsung Electro-Mechanics’ First Mass Production of “Power Inductor” for Automotive
Samsung Electro-Mechanics will target the automotive power inductor market in full-scale by beginning mass production of power inductors, an essential core component of electric and autonomous vehicles.
Cadence to Acquire Rambus PHY IP Assets
Cadence Design Systems, Inc. and Rambus Inc. today announced that they have entered into a definitive agreement for Cadence to acquire the Rambus SerDes and memory interface PHY IP business.
How the CHIPs Act Changed the Chip Industry – A Year Later
One year after passing the CHIPs Act, and there are still questions about whether its influence will be positive or negative.
Synopsys Accelerates Advanced Chip Design with First-Pass Silicon Success of IP Portfolio on TSMC 3nm Process
Synopsys, Inc. technology is unleashing a new wave of advanced designs with the industry’s broadest portfolio of interface IP for the TSMC N3E process.
NXP Semiconductors Executive Reelected Board Chair of Silicon Integration Initiative for 2023-2024
Pankaj Kukkal, executive vice president of MCU/MPU Engineering for NXP Semiconductors, has been elected to a second term as board chair at Silicon Integration Initiative.
TSMC Is Stabilizing, But Has Yet to Hit the Floor, Says GlobalData
Following the news that TSMC reported solid Q2 2023 results; Josep Bori, Thematic Research Director at GlobalData, offers his view.
Heterogeneous Integration: Expert Panel Addresses the Challenges Ahead
At SEMICON West, Applied Materials hosted a panel of experts that focused on emerging trends in heterogeneous design and integration using advanced packaging technology.
System Companies Shake Up Semis with Middle Man Cuts, Vertical Shifts, and More
The economic death of Moore’s Law brings a simpler semiconductor value chain, the rise of system companies, software ownership, cuts to the middle man, vertical shifts, and IP M&As.
MACOM Awarded U.S. Air Force Contract for Advanced Semiconductor Development
MACOM Technology Solutions Inc. today announced that it has been awarded a contract from the United States Air Force Research Laboratory to develop advanced semiconductor process technology related to Gallium Nitride-on-Silicon Carbide.
