Multi-year agreement between STMicroelectronics and Renault Group secures Ampere’s supply of Silicon Carbide power modules.
ASIC Supplier ICsense Selected for GlobalFoundries’ Official Design Partner Network
ICsense, a TDK Group Company and independent subsidiary specializing in the design of Application Specific Integrated Circuits (ASICs), has announced a new partnership with GlobalFoundries.
ULVAC Launches New Deposition System for Semiconductor Applications
ULVAC, Inc. has started accepting orders for the ENTRON-EXX, a new multi-chamber deposition system for semiconductor applications.
SEMI Publishes Recommendations for Semiconductor Policies in the 2024-2029 European Commission Legislative Term
SEMI, the industry association serving the global electronics design and manufacturing supply chain, today published recommendations for the European Union to bolster its semiconductor ecosystem.
Omdia Forecasts 32.7% Year on Year Increase in Large-Area OLED Shipments in 2025 Driven by IT OLED Growth
Shipments of large-area OLEDs, those over 9-inches are expected to increase by 32.7% year-on-year (YoY) in 2025 according to Omdia.
Hitachi High-Tech Launches DCR Etch System 9060 Series, Supporting Isotropic Etching of Advanced 3D Devices at the Atomic Level
Hitachi High-Tech Corporation announced today the launch of its DCR Etch System 9060Series.
Jean-Marc Chery, President & CEO, STMicroelectronics Named New GSA Board of Directors Chair
The Global Semiconductor Alliance (GSA) Board of Directors welcomes our new appointed Chair, Jean-Marc Chery, President & CEO, STMicroelectronics.
Nova Acquires Sentronics Metrology
Nova announced today that it has entered into a definitive agreement to acquire Sentronics Metrology GmbH.
Morse Micro Appoints Yoshikazu Oishi as VP
Morse Micro announced the appointment of Yoshikazu Oishi as VP, Country Manager for Japan, effective immediately.
ROHM Semiconductor and Valeo Co-Develop the Next Generation of Power Electronics
ROHM Semiconductor and Valeo, an automotive technology company, today announced they are collaborating to propose and optimize the next generation of power modules for electric motor inverters using their combined expertise in power electronics management.
