IMEC’s acquisition of CAMECA’s Invizo 6000 will contribute to its advanced research and development for future logic, memory, and interconnected architectures.
Finalists Selected for Round Six of Luminate NY
Empire State Development (ESD) announced the 10 companies selected to take part in round six of the Luminate NY accelerator program, investment fund, and competition.
Microchip Reaches Milestone in $800 Million, Multi-Year Initiative
Microchip reached a milestone in its multi-year, $800 million initiative aiming to triple production capacity at its Gresham, Oregon manufacturing facility.
New AI Model Transforms Understanding of Metal-Organic Frameworks
Researchers at EPFL and KAIST have created a transformer for Metal-Organic Frameworks (MOFs), a class of porous crystalline materials. By combining organic linkers with metal nodes, chemists can synthesize millions of different materials with potential applications in energy storage and gas separation.
IMAPS Advanced System-in-Package Conference is Now CHIPcon
The top global event for advanced Chiplet and Heterogeneous Integration Packaging (CHIP) technologies to be held in July 2023.
Intrinsic Semiconductor Technologies Secures $8.5M Investment to Solve the Memory Bottleneck for Data Hungry Applications
Innovative non-volatile memory technology from UCL spin-out will create a new generation of small devices with big brains that embed intelligence everywhere.
Micron Releases ‘We Are Micron’ 2022 Diversity, Equality and Inclusion Report
Initiatives creating readiness for the workforce of the future and highlighting ongoing commitment to diversity.
Electric Vehicle Components Market Is Estimated To Be Valued At US$ 1001.95 Billion By 2032
The market is further expected to gain size of USD 1001.95 Billion by the year 2032. The market is expected to grow with a CAGR of 21.05% in the forecast period.
Tower Semiconductor Announces World’s First Heterogeneous Integration of Quantum Dot Lasers on its Popular SiPho Foundry Platform PH18
Tower Semiconductor, a foundry of high-value analog semiconductor solutions, in collaboration with Quintessent, Inc, today announced the world’s first heterogeneous integration of GaAs quantum dot (QD) lasers and a foundry silicon photonics platform (PH18DB).
Tower Semiconductor and Teramount Announce Technology Collaboration Connecting a Large Number of Optical Fibers to Silicon Chips
Tower Semiconductor, a foundry of high value analog semiconductor solutions, and Teramount today announced a collaboration based on Teramount’s ‘PhotonicPlug’ technology and Tower’s silicon photonic ‘Bump-ready’ wafers.‘
