Today, Lenovo and WEKA announced a new global agreement focused on offering solutions for next-generation data management architectures and performance-intensive workloads for delivery in more than 160 markets worldwide.
HARMAN and proteanTecs Collaborate to Advance Predictive and Preventive Maintenance for Automotive Electronics
proteanTecs and HARMAN Ltd. focused on designing consumer experiences at automotive grade, have collaborated to advance a new approach to predictive and preventive maintenance of vehicle electronics.
Global Semiconductor Company Solidigm Names Rancho Cordova Global Headquarters
Solidigm, a U.S.-based leading global provider of innovative NAND flash memory solutions, has named the City of Rancho Cordova in Greater Sacramento the company’s new global headquarters.
Executives Identify Technology and Digital Transformation as the #1 Way to Bolster Innovation Amidst Challenging Market Conditions
2023 State of Revenue Report from Model N identifies pharmaceutical, medical technology and high-tech manufacturer perspectives on market challenges.
BrainChip Partners with AI Labs on Next-Generation Application Development
BrainChip Holdings Ltd, the world’s first commercial producer of ultra-low power, fully digital, event-based, neuromorphic AI IP, today announced a partnership with AI Labs Inc. to collaborate on next-generation application development leveraging the Minsky AI Engine.
Global Semiconductor Sales Increase 3.2% in 2022 Despite Second-Half Slowdown
Worldwide industry sales totaled a record $573.5 billion in 2022, but sales slowed significantly during second half of year.
Nanoscale Ferroelectric Semiconductor Could Power AI and Post-Moore’s Law Computing on a Phone
Next-gen computing material gets down to the right size for modern manufacturing.
Aldec Releases Automated Static Linting and CDC Analysis for Microchip FPGA and SoC FPGA Designs
Aldec, Inc. has updated its popular linting tool ALINT-PRO to enhance the support of Microchip Technology’s Libero SoC Design Suite.
Singapore’s Capcon Raises Around $50 Million
Capcon, a Singapore-based advanced packaging solution provider, has secured around $50 million in series B2 funding.
8th Annual CMC Conference in Round Rock, Texas
Join chip fabricators and suppliers in discussing current trends and issues for the semiconductor materials supply chain.
