Intel and the University of California, San Diego have been selected for the DARPA Hardening Development Toolchains Against Emergent Execution Engines program.
Axcelis President and CEO Mary Puma Named International Board Chairperson of SEMI Industry Association
Puma will lead the SEMI International Board of Directors in evolving the association’s operations, programs and services worldwide to support the growth of member companies throughout the supply chain.
Littelfuse Acquires Western Automation Research and Development
Littelfuse, Inc. today announced it has acquired Western Automation Research and Development Limited.
Alchip Technologies Announces 3DFabric Alliance Support Plans
Alchip Technologies is putting teeth into its role as a founding member of TSMC’s 3DFabric Alliance by enhancing its 3nm process technology and advanced packaging capabilities.
CAES Wins Award to Deliver Dual System-in-Package Circuit Card Assemblies
Award marks continued partnership with CAES, MITRE and the US Air Force to deliver advanced electronics.
Integra Selects Kansas for OSAT Semiconductor Project
Kansas State Finance Council’s APEX vote paves way for
transformative expansion project in Wichita region
U.S. and India Semiconductor Groups Announce Initiative to Strengthen Public-Private Collaboration in Chip Ecosystem
The U.S. Semiconductor Industry Association (SIA) and the India Electronics and Semiconductor Association (IESA) today jointly announced plans to form a private-sector task force that will strengthen collaboration between the two countries in the global semiconductor ecosystem.
pSemi Announces High-linearity Sub-6 GHz RF Switches Reach Volume Production
pSemi Corporation, a Murata company focused on semiconductor integration, announces the production readiness of two new high-linearity switches targeted for the latest 5G wireless infrastructure and massive MIMO base station deployments.
MACOM Announces Definitive Agreement to Acquire Assets and Operations of OMMIC SAS
MACOM Technology Solutions Holdings, Inc., a supplier of semiconductor products, today announced that it has entered into a definitive agreement through one of its French subsidiaries to acquire the assets and operations of OMMIC SAS.
Azbil Launches New Sapphire Capacitance Diaphragm Gauges with MEMS Processing Technology to Enhance Resistance to Deposition
Azbil Corporation announced the availability as of January 25 of its model V8 sapphire capacitance diaphragm gauges, which employ MEMS processing technology to enhance resistance to deposition on the sensor.
