MAGAZINE
March
Advanced Semiconductor Packaging Market Forecast to Grow at 7.5% CAGR Through 2031
The Advanced Semiconductor Packaging Market was valued at USD 18090 Million in the year 2024 and is projected to reach a revised size of USD 29800 Million by 2031, growing at a CAGR of 7.5% during the forecast period.
OKI Develops 124-Layer PCB Technology for Next-Generation AI Semiconductor Testing Equipment
OKI Circuit Technology has successfully developed 124-layer PCB technology for wafer inspection equipment designed for next-generation high bandwidth memory, such as HBM mounted on AI semiconductors.
Applied Materials Announces a Strategic Investment in BE Semiconductor Industries
Purchased 9 percent of outstanding shares to build upon four years of successful collaboration on hybrid bonding technology for advanced packaging.
In the Face of Escalating Trade Wars, Semiconductor Industry Must Evaluate Supply Chain Design Process
Escalating trade wars are highlighting the need for companies to protect technological advantages in critical industries, including semiconductor manufacturing.
Infineon Launches World’s First Industrial GaN Transistor Product Family with Integrated Schottky Diode
Infineon Technologies AG has introduced the world’s first gallium nitride (GaN) power transistors with integrated Schottky diode for industrial use.
TechInsights Releases Initial Findings of its NVIDIA Blackwell HGX B200 Platform Teardown
TechInsights today released early-stage findings of its teardown analysis of the NVIDIA Blackwell HGX B200 platform delivering advanced artificial intelligence (AI) and high-performance computing (HPC) performance in the data center.
Canatu Signs Joint Development Agreement with DENSO to Improve Carbon Nanotube Performance
Canatu Plc has signed a one-year joint development agreement with DENSO Corporation, a supplier of automotive technology and components, to improve the performance of Canatu carbon nanotubes.
Electronic System Design Industry Posts $4.9 Billion in Revenue in Q4 2024
Electronic System Design (ESD) industry revenue increased 11% to $4,927.3 million in the fourth quarter of 2024 from the $4440.9 million reported in the fourth quarter of 2023.
Two-Dimensional Semiconductor Materials Venture Into Space
In a groundbreaking experiment, researchers from Tsinghua University have proven that two-dimensional (2D) semiconductor materials can withstand the harsh conditions of space.
Reshaping Quantum Dots Production Through Continuous Flow and Sustainable Technologies
Quantum dots are attracting particular attention due to their unique properties and wide range of applications. A team of researchers has recently made a significant contribution by proposing a more sustainable approach to the production.
Qolab Spearheads Hardware Development for DARPA’s Quantum Benchmarking Initiative
Qolab is spearheading the hardware development of the consortium, focusing on designing and fabrication of the quantum processors.
SEMI Silicon Photonics Industry Alliance Launches Three Special Interest Groups to Lay Out a Technology Roadmap
The SEMI Silicon Photonics Industry Alliance (SiPhIA) held the Bridging Light & Silicon: SEMI SiPhIA SIGs Kick-off & Seminar today, announcing the official launch of three Special Interest Groups (SIGs) aimed at integrating expertise from various sectors to formulate industry standards and accelerate technological innovation and commercialization.
STMicroelectronics Details Company-Wide Program to Reshape Manufacturing Footprint
STMicroelectronics today disclosed further elements of its program to reshape its global manufacturing footprint.
Accelsius Achieves Industry-Leading Thermal Milestones for Next-Generation AI Computing
Accelsius announced two major thermal testing milestones today, demonstrating the unmatched performance and scalability of its proprietary two-phase, direct-to-chip NeuCool solution.
IEEE Study Leverages Silicon Photonics for Scalable and Sustainable AI Hardware
Researchers have developed a new hardware platform for AI accelerators capable of handling significant workloads with reduced energy requirement.
Global Semiconductor Equipment Billings Surged to $117 Billion in 2024, SEMI Reports
Worldwide sales of semiconductor manufacturing equipment increased 10% to $117.1 billion in 2024 from $106.3 billion in 2023, SEMI, the industry association representing the global electronics design and manufacturing supply chain, reported today.
Czech Semiconductor Centre Launches in Brno, Strengthening Europe’s Chip Autonomy
A new chapter in Europe’s semiconductor independence has begun in Brno with the launch of the Czech Semiconductor Centre (CSC).
From Microelectronics to Microfluidics: How 3D Printing Is Shaping the Future of Tiny Devices
The world of micro and nano devices is undergoing a seismic shift, thanks to the latest advancements in 3D printing technology.
Computing Breakthrough Award Goes to Key Figure in Microchip Revolution
UCLA Professor Jason Cong recognized with the ACM Chuck Thacker Award for Improving the Automation and Customizability of Computing Systems.
FormFactor Introduces the EVOLVITY 300 Probe System
Company expands the 300mm product line with new semi-automated system.
Nexperia Introduces New High Speed Optimized Flip-Chip Package Technology
New flip-chip land grid array (FC-LGA) packages deliver superior RF performance and meet automotive quality with industry’s first side-wettable flank versions.
Cyient Announces the Launch of Semiconductor Subsidiary
By carrying forward Cyient’s expertise in semiconductor design, Cyient Semiconductors will focus on scaling Application-Specific Integrated Circuit (ASIC) turnkey solutions for customers.
Omnitron Sensors Appoints Ijaz Jafri as Vice President of Engineering
Dr. Jafri brings a 20+-year track record of successfully bringing disruptive MEMS and semiconductor technologies to market in the automotive, industrial, aerospace, defense and consumer sectors.
Featured Video
At SEMICON West 2024, Advanced Energy further expanded on the theme of ‘Advancing the Angstrom Era’ by demonstrating its latest plasma power, high-voltage and critical temperature measurement and control technologies. Editor-in-Chief Pete Singer talked to Dhaval Dhayatkar, a Senior Director of Marketing of Plasma Power at Advanced Energy, about the company’s latest products, including new, modular platforms that meet demands for high power, high efficiency and power density AC-DC solutions across semiconductor processing and test equipment.
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Building Fabs in the U.S. vs Taiwan: Twice as Long, Twice as Much
Construction costs in the U.S., compared to Taiwan, are about twice as much (the process equipment costs are similar). “Building a wafer fab in the west costs twice as much and takes twice the time of building it in Taiwan,” Exyte’s Blaschitz said at SEMI’s ISS.
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