Synopsys and Samsung Foundry Enable 3nm Process Technology for Power- and Performance-Demanding Mobile, HPC and AI Designs

Synopsys, Inc. today announced that its longstanding collaboration with Samsung Foundry has produced multiple successful test chip tapeouts on Synopsys digital and custom design tools and flows, certified for Samsung Foundry’s most advanced process.

SEMIFIVE Announces New 5nm HPC SoC Platform

SEMIFIVE, a design solution provider and pioneer of platform-based custom silicon solutions, today revealed its latest SoC Platform targeting high performance compute (HPC) applications.

Miniaturized, Energy Efficient, and Faster Than Silicon: This New Computer Chip Is Ideal for AI

Artificial intelligence presents a major challenge to conventional computing architecture. In standard models, memory storage and computing take place in different parts of the machine, and data must move from its area of storage to a CPU or GPU for processing.

Mark Templeton Inducted into Phil Kaufman Hall of Fame by the ESD Alliance and IEEE CEDA

Mark Templeton, the former managing director of investment firm Scientific Ventures, and a Lanza techVentures investment partner and board member, today was inducted posthumously into the Phil Kaufman Hall of Fame.

POSi Energy – Silicon Power Announces Breakthrough in Anode Development for Lithium-ion Batteries

Today, POSi Energy – Silicon Power, announced the demonstration of a new lithium-silicon anode that allows a revolutionary performance step-up in lithium-ion batteries.

Powering the Quantum Leap

The role of cryogenic wafer probing in applications such as cryogenic quantum computing and supra-conductive CMOS semiconductors, where temperatures near absolute zero are essential, is discussed.

Intel 4 Process Drops Cobalt Interconnect, Goes with Tried and Tested Copper with Cobalt Liner/Cap

At the VLSI Symposia in June, Intel presented a paper “Intel 4 CMOS Technology Featuring Advanced FinFET Transistors Optimized for High Density and High-Performance Computing.” Blogger Dick James reports on details of the interconnect strategy.

KLA Announces Plans to Build a New R&D and Manufacturing Facility in Newport, Wales

KLA Corporation has announced plans to build a new research-and-development (R&D) and manufacturing center for the SPTS division, in Newport, Wales, UK.

The Road to Future AI Is Paved with Trust

Linköping University is coordinating TAILOR, a EU project that has drawn up a research-based roadmap intended to guide research funding bodies and decision-makers towards the trustworthy AI of the future.

Research Reveals Quantitative and High-Resolution Pressure Functions of Pressure-Sensitive Material

Researchers from Nagoya University in central Japan have published a study in the Journal of Materials Chemistry on a pressure-sensitive material, known as fluorenylidene-acridane (FA). Their research has potential applications for technologies related to pressure sensing, recording, and display devices.