Henkel and CITC Forge Partnership to Accelerate High-Thermal Die Attach Solutions

Henkel and Chip Integration Technology Center (CITC) announced today that the organizations have formalized an agreement to collaborate on the development of high-thermal die attach solutions for radio frequency (RF) and power electronics. 

Gwangju Institute of Science and Technology Scientists Improve the Power Output of Triboelectric Nanogenerators with Carbon Particles

Mesoporous carbon spheres facilitate charge transport and high surface charge densities in triboelectric nanogenerators for a 1300-fold higher output current.

Micron Announces $40 Billion Investment in Leading-Edge Memory Manufacturing in the US

Largest ever investment in U.S. memory manufacturing will create an estimated 40,000 American jobs, strengthen national security and bolster supply chain resilience.

GlobalFoundries and Qualcomm Announce Extension of Long-term Agreement to Secure U.S. Supply through 2028

Today’s announcement secures wafer supply and commitments to support U.S.-based manufacturing through capacity expansion at GF’s most advanced semiconductor manufacturing facility, in Malta, New York.

Nordson Corporation Announces Agreement to Acquire CyberOptics Corporation

The acquisition enhances Nordson’s test and inspection platform, providing differentiated technology that expands Nordson’s product offering in the semiconductor and electronics industries.

GlobalFoundries, Applied Materials and Ford to Co-Host CEO Summit to Secure U.S. Chip Supply Chain

GlobalFoundries, Applied Materials, Inc. and Ford Motor Company today announced that the three companies’ CEOs will be co-hosting a summit of senior government officials, CEOs and C-suite executives from companies either involved in technology manufacturing or companies whose ability to compete depends on continued innovation, technology leadership and access to semiconductor chips in the U.S. 

Towards Higher Nanopatterning Resolution with Molecules that Fill Nanogaps Better

Ultraviolet nanoimprint lithography (UV-NIL) is a method of creating patterns at the nanoscale with widespread applications in optoelectronics, photonics, and biology due to its low cost and scalability.

U.S. Chip Expansions Squeezed by Shortages of Specialty Materials

What is the root cause of the semiconductor chip shortage? Is it simply a matter of chipmakers not having enough production capacity, or is something else at play?

NEO Semiconductor Awarded “Best of Show” for Most Innovative Memory Technology

X-NAND Gen2 that enables 3D NAND flash memory with 20X faster write performance received top honors at Flash Memory Summit 2022.

Intel Orders Delayed, TSMC Slows Three-Nanometer Expansion, Says TrendForce

According to TrendForce research, Intel plans to outsource the tGPU chipset in Meteor Lake to TSMC for manufacture.