Industry consortium proposes solutions for the National Semiconductor Technology Center and the National Advanced Packaging Manufacturing Program requested in the CHIPS+ Act.
IC Sales Turn Negative as Economy Weighs on Market
Never-before seen decline in June IC market driven by steep drop in memory pricing.
The Democratization of Chip Design
The open-source silicon movement with a community-based, open-source platform of easy-to-use, easy-to-access tools is a practical and efficient way to ensure innovation and has the potential to drive exponential semiconductor industry growth.
Smart Microrobots Learn How to Swim and Navigate with Artificial Intelligence
The AI-powered swimmer is able to switch between different locomotory gaits adaptively to navigate toward any target location on its own.
InnovationLab Demonstrates Breakthrough PCB Production Method Based on Additive Manufacturing
InnovationLab, the expert in printed electronics “from lab to fab”, announces it has achieved a breakthrough in additive manufacturing of printed circuit boards (PCBs), helping meet higher environmental standards for electronics production while also reducing costs.
US/China Tension Must Be Seen in the Context of Taiwan’s TSMC’s Critical Role in the Global Semi Supply Chain
Following the news of raising tension between the US and China as a result of US House Speaker Nancy Pelosi recent visit to Taiwan; Josep Bori, Research Director in the Thematic team at GlobalData, a leading data and analytics company, offers his view.
New Wafer-like and Reticle-like Sensors Deliver Fast, Easy Measurements Inside the Process Chamber
Sensors are available for a range of routine and specialized applications. The two newest sensors offer significant advancements in terms of performance and range of application.
An Interview with Kistler’s Robert Hillinger
Robert Hillinger, Business Development Manager at Kistler, explains how dynamic force measurement increases process reliability in semiconductor production.
Lip-Bu Tan, Executive Chairman of Cadence Design Systems and Chairman of Walden International, to Receive Semiconductor Industry’s Top Honor
Tan, renowned tech visionary and venture capital pioneer, will accept 2022 Robert N. Noyce Award during SIA Awards Dinner on Nov. 17.
SK hynix Develops World’s Highest 238-Layer 4D NAND Flash
SK hynix Inc. announced today that it has developed the industry’s highest 238-layer NAND Flash product.
