MAGAZINE
March
Advanced Semiconductor Packaging Market Forecast to Grow at 7.5% CAGR Through 2031
The Advanced Semiconductor Packaging Market was valued at USD 18090 Million in the year 2024 and is projected to reach a revised size of USD 29800 Million by 2031, growing at a CAGR of 7.5% during the forecast period.
OKI Develops 124-Layer PCB Technology for Next-Generation AI Semiconductor Testing Equipment
OKI Circuit Technology has successfully developed 124-layer PCB technology for wafer inspection equipment designed for next-generation high bandwidth memory, such as HBM mounted on AI semiconductors.
Broadcom President & CEO Hock Tan to Receive Global Semiconductor Alliance’s Highest Honor
Global Semiconductor Alliance (GSA) announced it will honor Hock Tan, President and CEO of Broadcom, with its prestigious Dr. Morris Chang Exemplary Leadership Award at this year’s Annual Awards Celebration on Dec. 5, 2024.
Earthquake on a Chip: Scientists Harness Sound Waves on the Surface of a Microchip
New chip design uses special glass to allow interactions between light and sound.
GlobalFoundries and NXP to Deliver Next-Generation 22FDX Solutions for Automotive, IoT and Smart Mobile
Building on years of collaboration, this new process technology collaboration will provide power-efficient and secure connectivity solutions for essential consumer and industrial applications manufactured both in Europe and the U.S.
Nord Quantique Secures Semiconductor Supply Chain Through Two New Partnerships
Nord Quantique today announced two new partnerships to secure its supply chain long-term, as it relates to chip fabrication for its quantum computers.
U.S.-Canada Collaboration Grows with Bilateral Discussions Between C2MI and NY CREATES
The cross-border collaboration between Canadian and U.S. semiconductor-centered R&D, prototyping, and manufacturing industries continues to focus on ways to connect to expand opportunities as C2MI (MiQro Innovation Collaborative Centre), based in Bromont, Québec, Canada, and NY CREATES, based in Albany, NY, build upon their partnership that began in early 2024.
SPIE Photonics West 2025 Now Open for Registration
This year, the week will include 4,500-plus technical presentations across more than 100 technical conferences, as well as hosting over 1,200 companies in four focused exhibitions.
HKU Engineering Team Develops Soft Microelectronics Technologies Enabling Wearable AI for Digital Health
Leveraging rapid technological advances for human health is a global trend, driving the rise of biomedical engineering research. A fast-rising field is wearable biosensors, which have the potential to realise digital healthcare and AI medicine.
SEMICON Japan 2024 to Expand Scope with Spotlight on Advanced Design Innovation
SEMICON Japan 2024, the largest gathering of leaders from the microelectronics manufacturing supply chain in Japan, will assemble more than 1,000 exhibitors showcasing semiconductor solutions for smart technologies from Dec. 11-13 at Tokyo Big Sight.
Infinera’s Planned Expansion Enhances Lehigh Valley’s Legacy of Technological Innovation
Infinera announced it has tentatively agreed to receive up to $93 million in federal funding to expand operations, including in the Lehigh Valley.
Hemlock Semiconductor to Significantly Expand U.S. Production Capacity of Semiconductor-Grade Polysilicon
Today, the Biden-Harris Administration announced that the U.S. Department of Commerce and Hemlock Semiconductor (HSC) have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $325 million in proposed direct funding under the CHIPS and Science Act.
Gartner Identifies the Top 10 Strategic Technology Trends for 2025
Gartner, Inc. today announced its list of 10 top strategic technology trends that organizations need to explore in 2025. Analysts presented their findings during Gartner IT Symposium/Xpo, taking place here through Thursday.
Kioxia to Unveil Emerging Memory Technologies at IEDM 2024
Kioxia Corporation today announced that the company’s research papers have been accepted for presentation at IEEE International Electron Devices Meeting (IEDM) 2024, a prestigious international conference to be held in San Francisco, USA, from December 7th to 11th.
Global Silicon Wafer Shipments to Remain Soft in 2024 Before Strong Expected Rebound in 2025, SEMI Reports
Global shipments of silicon wafers are projected to decline 2% in 2024 to 12,174 million square inches (MSI) with a strong rebound of 10% delyated until 2025 to reach 13,328 MSI as wafer demand continues to recover from the downcycle, SEMI reported today in its annual silicon shipment forecast.
Process Materials Lead the Way in 2024 with 7% CAGR through 2028 Amid Global Challenges
Following a 12% year-over-year decline in 2023 driven by a sluggish industry and inventory correction, revenues for total materials in 2024 is expected to see 3-4% growth as conditions improve.
Arteris Network-on-Chip Tiling Innovation Accelerates Semiconductor Designs for AI Applications
Arteris, Inc. today announced an innovative evolution of its network-on-chip (NoC) IP products with tiling capabilities and extended mesh topology support for faster development of Artificial Intelligence (AI) and Machine Learning (ML) compute in system-on-chip (SoC) designs.
POET Wins “Best in Artificial Intelligence” Honors at 2024 Global Tech Awards
The honor is the third top prize the Company has received in 2024, following recognition by the AI Breakthrough Awards for “Best Optical AI Solution” and the Gold Prize for “AI Innovator of the Year” from the Merit Awards.
SEALSQ and Allion Japan Inc. Partner to Help IoT Device Manufacturers Build Secure, Standard-Compliant Products
The partnership aims to assist IoT device manufacturers in creating secure and standard-compliant products, meeting key protocols such as Matter, and complying with new international IoT security regulations like the EU Cyber Resilience Act (CRA) and the US Cyber Trust Mark.
IDTechEx Report Highlights the Rise of Chiplet Technology in Semiconductors
The report highlights how chiplets offer a promising path forward, providing flexibility, modularity, customizability, efficiency, and cost-effectiveness in chip design and manufacturing.
CEA-Leti Launches OpenTRNG
CEA-Leti today announced an open-source project to produce physical True Random Number Generators (TRNG) using ring-oscillator-based architectures.
Samsung Develops Industry’s First 24Gb GDDR7 DRAM for Next-Generation AI Computing
Samsung Electronics Co., Ltd. today announced it has developed the industry’s first 24-gigabit (Gb) GDDR7 DRAM.
Microchip’s RTG4 FPGAs with Lead-Free Flip-Chip Bumps Achieve Highest Space Qualification
QML Class V designation recognizes exceptional reliability and longevity for critical space missions.
Featured Video
At SEMICON West 2024, Advanced Energy further expanded on the theme of ‘Advancing the Angstrom Era’ by demonstrating its latest plasma power, high-voltage and critical temperature measurement and control technologies. Editor-in-Chief Pete Singer talked to Dhaval Dhayatkar, a Senior Director of Marketing of Plasma Power at Advanced Energy, about the company’s latest products, including new, modular platforms that meet demands for high power, high efficiency and power density AC-DC solutions across semiconductor processing and test equipment.
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Building Fabs in the U.S. vs Taiwan: Twice as Long, Twice as Much
Construction costs in the U.S., compared to Taiwan, are about twice as much (the process equipment costs are similar). “Building a wafer fab in the west costs twice as much and takes twice the time of building it in Taiwan,” Exyte’s Blaschitz said at SEMI’s ISS.
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