Accellera Systems Initiative Honors Lynn Garibaldi with 2022 Leadership Award

Garibaldi is recognized for 30 years of service and achievements since the founding of the Accellera standards organization.

Lam Research, Entegris, Gelest Team Up to Advance EUV Dry Resist Technology Ecosystem

Collaboration provides robust chemical supply chain for global chipmakers using the breakthrough technology and supports R&D for next-generation EUV applications.

ClassOne Technology Announces New Surface Preparation Technologies that Extend the Solstice Single-Wafer Platform

ClassOne Technology, a global provider of advanced electroplating and wet processing tools for microelectronics manufacturing, today announced it has expanded its flagship Solstice automated single-wafer platform with a suite of surface preparation (SP) technologies.

EV Group Achieves Die-to-Wafer Fusion and Hybrid Bonding Milestone with 100% Die Transfer Yield on Multi-Die 3D SoC

EV Group (EVG) today announced it has achieved a major breakthrough in die-to-wafer (D2W) fusion and hybrid bonding by successfully demonstrating 100-percent void-free bonding yield of multiple die of different sizes from a complete 3D system-on-a-chip (SoC) in a single transfer process using EVG’s GEMINI FB automated hybrid bonding system.

Global Total Semiconductor Equipment Sales On Track to Record $118 Billion in 2022

Global sales of total semiconductor manufacturing equipment by original equipment manufacturers are forecast to reach a record $117.5 billion in 2022.

Show Daily 2022 — Day One

View or Download the SEMICON West Show Daily — Day One!

Good Progress on Sustainability, but Challenges are Complex

The semiconductor industry continues to make good progress on sustainability issues. Late last year and earlier this year, major commitments to sustainability were made by TSMC, Intel, Micron, Applied Materials, Lam and many others. 

Piezoresistive Design for Electronic Skin: From Fundamental to Emerging Applications

A new publication from Opto-Electronic Advances considers piezoresistive design for electronic skin. Electronic skin (e-skin) represents one major flexible device which can mimic the diverse functions of human skin effectively, and holds promising prospect for applications in prosthetic, robot, and medical detection and diagnosis.

Are Micron and the Taiwanese Semi Suppliers the Canaries in the Coal Mine?

Early warning signs of a turning point in the semiconductor industry cycle becoming more evident.

Cadence to Acquire Future Facilities

Cadence Design Systems, Inc. announced today that it has entered into an agreement to acquire Future Facilities.