Fab equipment investment in 2023 is expected to remain strong.
Sony, Samsung, Toshiba, Toppan Have Image Sensor/LiDAR Papers at the VLSI Symposia in June
Since the development of mobile phone camera image sensors, they have been a hot topic with continuous evolution to sub-micron pixels, and more recently the move towards self-driving cars (and other ranging needs) is pushing LiDAR systems.
SEMICON West 2022 Hybrid to Spotlight Sustainability, Smart Technologies, Talent
Sustainability, smart technologies and workforce development will take center stage at SEMICON West 2022 Hybrid, July 12-14 at the Moscone Center in San Francisco, as more than 200 industry leaders, visionaries and technology experts convene
“BEST OF WEST” Deadline Extended
We have extended our submission deadline to Friday, June 10th. Finalists will be announced prior to SEMICON West. The winner will be announced Wednesday, July 13, 2022 at SEMICON West.
Sen. Mark Warner, Semiconductor Industry Execs Meet to Discuss Strengthening Domestic Chip Research, Design, Manufacturing
The Semiconductor Industry Association (SIA) today convened a productive roundtable discussion between Sen. Mark Warner (D-Va.) — one of the senators tasked with negotiating the U.S. jobs and competitiveness package — and more than a dozen senior executives from SIA member companies.
Top Three Suppliers Held 94% of 2021 DRAM Marketshare
Samsung, SK Hynix accounted for 71% of DRAM sales. Major supplier base now reduced to six.
Semiconductor Growth Still Seen at 11% Despite 2022 Headwinds
New quarterly update shows higher gains in microprocessors and power discretes this year, but lowers sales increases in optoelectronics while the global economy faces greater risks.
Mitsubishi Electric Expands Silicon Carbide Power Device Lineup With Industry Standard Package Dual Device
Mitsubishi Electric US, Inc. recently launched a new Silicon Carbide (SiC) power module FMF400DY-24B.
RISC-V Summit China 2022 Announces Call for Papers
The Summit will showcase the continued rapid expansion of the RISC-V ecosystem, with both commercial offerings and exciting open-source developments.
Global Embedded Die Packaging Technology Market to Generate $311.41 Million by 2030
Increase in requirement for miniaturization of electronic circuits in microelectronic devices drives the growth of the global embedded die packaging technology market.
