Under the theme, “The 75th anniversary of the Transistor and the Next Transformative Devices to Address Global Challenges,” the 68th annual IEEE International Electron Devices Meeting (IEDM) has issued a Call for Papers seeking the world’s best original work in all areas of microelectronics research and development.
Applied Materials’ New Ioniq PVD System Solves Wiring Resistance Challenges of 2D Scaling
Applied Materials, Inc. today introduced a new system that re-engineers the deposition of transistor wiring to significantly reduce electrical resistance, which has become a critical bottleneck to further improvements in chip performance and power.
Showa Denko Starts Shipment of Newly Developed HD Media for Record-breaking 26TB Near-line HDD
Showa Denko K.K. (SDK) has started shipment of newly developed 3.5-inch hard disk media (HD media) to be used in 26 terabyte (TB) hard disk drive (HDD), which has the largest storage capacity the HDD industry has ever produced.
MegaChips Forms Strategic Partnership with BrainChip
MegaChips, a custom ASIC company in Japan, and BrainChip Holdings Ltd, the world’s first commercial producer of ultra-low power neuromorphic AI IP, formally announced a strategic partnership signed late last year.
Beyond Semiconductor Packaging Materials: Advanced Silicone Solutions
Advanced silicones are enabling semiconductor manufacturers to address a variety of challenges.
Gov. Whitmer Announces New Semiconductor Career and Apprenticeship Network Program Aimed at Creating Good-Paying Jobs
Today, Governor Gretchen Whitmer joined the Michigan Economic Development Corporation to announce Michigan Strategic Fund (MSF) approval of support for a new semiconductor technician apprenticeship program intended to strengthen the pipeline of the semiconductor workforce.
Ayar Labs to Accelerate Development and Application of Optical Interconnects in Artificial Intelligence/Machine Learning Architectures with NVIDIA
Ayar Labs is developing with NVIDIA groundbreaking artificial intelligence (AI) infrastructure based on optical I/O technology to meet future demands of AI and high performance computing (HPC) workloads.
EV Group Lithography Solutions for Heterogenous Integration and Wafer-Level Packaging to be Highlighted at ECTC 2022
EV Group (EVG) announced that new developments in heterogeneous integration and wafer-level packaging enabled by its advanced lithography solutions will be highlighted in several papers being presented at the 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), to be held May 31-June 3 in San Diego, Calif.
Samsung Electronics and Red Hat Announce Collaboration in the Field of Next-Generation Memory Software
Samsung Electronics Co., Ltd. and Red Hat, Inc. today announced a broad collaboration on software technologies for next-generation memory solutions.
Argonne Scientists Use Quantum Computers to Simulate Quantum Materials
Scientists achieve important milestone in making quantum computing more effective.
