Nova today announced that its co-authored paper with IBM Research on “In-Line Raman Spectroscopy for Stacked Nanosheet Device Manufacturing” has been selected as the winner of the Diana Nyyssonen award for “best paper at SPIE’s 2021 Advanced Lithography Symposia.”
Space-Saving Schottky Rectifiers from Diodes Incorporated Set New Benchmarks in Current Density
Diodes Incorporated has announced the introduction of a series of high-current Schottky rectifiers in ultra-compact chip scale packages (CSPs).
Ayar Labs Raises $130 Million in Series C Funding, Accelerating Commercialization of Industry’s First In-Package Optical I/O Products
Boardman Bay Capital Management leads round joined by strategic investments from industry bellwethers Hewlett Packard Enterprise and NVIDIA, fast-tracking Ayar Labs’ transformational technology for AI, HPC, cloud, and telecom applications.
ClassOne Equipment Introduces New Takano Particle Inspection Systems to Replace Outdated Legacy Tools
ClassOne Equipment has just introduced two new high-performance Takano particle inspection systems for ≤200mm and ≤300mm unpatterned wafers.
DENSO and USJC Collaborate on Automotive Power Semiconductors
DENSO Corporation and United Semiconductor Japan Co., Ltd. today announced that the companies have agreed to collaborate on the production of power semiconductors at USJC’s 300mm fab in order to serve the growing demand in the automotive market.
Advantest ACS Nexus Enables Real-time Data Analytics for Semiconductor Test
New ACS Nexus enables real-time data streaming from distributed test floors across the semiconductor supply chain for the analytics solutions of customers and third-parties.
BSE Wins Multiple Orders from Leading OSAT for Zeus Gravity Test Handler for Automotive IC Handling
Boston Semi Equipment, a global semiconductor test handler and test automation company, announced today that it has received multiple orders for its Zeus gravity test handler from a major outsourced semiconductor assembly and test (OSAT) customer.
FLEX Conference 2022 to Highlight Latest Flexible Hybrid Electronics Innovations
FLEX Conference will gather industry experts July 11-14, 2022, at the Moscone Center in San Francisco for keynotes, panel discussions, technical sessions and product-based demonstrations highlighting the latest innovations in flexible and printed electronics.
Imec Ramps Up the Development of the High-NA EUV Patterning Ecosystem
This week, at the 2022 SPIE Advanced Lithography and Patterning Conference, imec presents significant progress in preparing the High-NA patterning ecosystem for the imec-ASML Joint High-NA Lab.
Wafer Capacity Forecast to Climb 8.7% As 10 New Fabs Enter Production
Even with more fabs, strong unit growth will keep industry capacity utilization at 93.0% in 2022.
