SEMI and TechSearch International today announced a new edition of the Worldwide Assembly & Test Facility Database offering significantly expanded coverage that now includes integrated device manufacturer (IDM) facilities.
Nova Expands Presence in China with New Office in Shanghai
Nova today announced the establishment of its new Chinese local corporate entity and the opening of a new Chinese headquarters in Shanghai.
New Multilayer Coating System for Wafers up to 300mm Diameter by Magnetron Sputtering
The scia Multi 300, the new magnetron sputter system by German thin film equipment manufacturer scia Systems, produces precise multilayer-stacks on 300 mm wafers. The Helmholtz-Zentrum Dresden-Rossendorf (HZDR) uses the system already to produce flexible and printable magnetic field sensors.
New AI Sensor Technology for Autonomous Driving
TU Graz is working together with Infineon on new, robust radar sensors for autonomous driving.
NXP Launches S32G Vehicle Integration Platform to Help Accelerate Software-Defined Vehicle Development
NXP Semiconductors has launched the S32G GoldVIP to help address real-time and application development challenges of software-defined vehicles using S32G vehicle network processors.
GaN Systems 3X Growth Drives Massive Expansion in Asia
GaN Systems, a developer of GaN power semiconductors, announced today it has expanded its Asia presence with a 3X increase in its operation in Taiwan.
Imec, KU Leuven and PragmatIC Semiconductor Demonstrate Fastest 8-bit Flexible Microprocessor for Low-Power Applications
This week, at the 2022 International Solid-State Circuits Conference (2022 ISSCC), imec, a research and innovation hub in nanoelectronics and digital technologies, KU Leuven, and PragmatIC Semiconductor, a developer of flexible electronics, present the fastest 8-bit microprocessor in 0.8µm metal-oxide flexible technology capable of running real-time complex assembly code.
Daniel Artusi Joins Gallium Semiconductor Advisory Board
Gallium Semiconductor, a supplier of RF Gallium Nitride (GaN) semiconductor solutions for 5G mobile communications, today announced the appointment of industry veteran Daniel Artusi to its Advisory Board.
NEXCOM Partners with AI Chipmaker Hailo to Launch Next-Generation Vehicular Telematics Solution
NEXCOM in-vehicle computer VTC 1021 features the Hailo-8 AI acceleration module, enabling AI performance at the edge for on-road vision and operational efficiency.
Porotech Secures $20M Series A investment
Microdisplay technology developer Porotech has secured $20 million Series A investment to accelerate global expansion and mass production of its unique micro-LED products.
