Lip-Bu Tan, one of the most influential leaders in the Tech Industry, is the Founder and Chairman of Walden International and Founding Managing Partner of Celesta Capital and Walden Catalyst Ventures.
Boosting AI Model Size and Training Speed with Lightwave-Connected Chips
AI growth is capped by data transfer rates between computing chips, but transferring data with light could remove the ceiling.
ASU Selected as Home and Partner for CHIPS and Science Act-Funded National Lab for Semiconductor Advanced Packaging
Following a week where a spirited effort by the Sun Devil football team captured the nation’s attention in the Peach Bowl, it is Arizona State University’s capability as a top-tier research university that has delivered ASU a momentous national win to kick off 2025.
Cadence to Acquire Secure-IC
Cadence today announced it has entered into a definitive agreement to acquire Secure-IC, a leading embedded security IP platform provider.
IEEE Electronic Components and Technology Conference Announces Best & Outstanding Papers from ECTC 2024
The IEEE Electronic Components and Technology Conference (ECTC), the world’s premier technical conference and product exhibition for the semiconductor packaging industry, has announced the winners of its prestigious Best and Outstanding Paper Awards for 2024.
Advanced Semiconductor Packaging Market to Generate US$ 40.3 Billion in Revenue by 2031
The Advanced Semiconductor Packaging Market, valued at US$ 30.1 Bn in 2022, is poised for steady expansion.
Ruth Hernandez Appointed as Chief Sales Officer at Soitec
Soitec announces the appointment of Ruth Hernandez as Chief Sales Officer. She will join the Executive Committee with responsibility for driving Soitec’s commercial success.
Development of a High-Performance AI Device Utilizing Ion-Controlled Spin Wave Interference in Magnetic Materials
A research team from NIMS and the Japan Fine Ceramics Center (JFCC) has developed a next-generation AI device—a hardware component for AI systems—that incorporates an iono-magnonic reservoir.
Micross Acquires Integra Technologies
Micross Components, Inc., a provider of high-reliability microelectronic product and service solutions for aerospace, defense, space, medical and industrial applications and a portfolio company of Behrman Capital, today closed the acquisition of Integra Technologies.
Enabling HBM 16H Stacks with Residue-Free Fluxless Active Oxide Removal
Using a plasma-based approach, active oxide removal technology empowers 3D chiplet integration and the HBM devices with fine bump pitch roadmaps and new package architectures.
