Alchip Technologies, Limited has moved its North American headquarters to upgraded accommodations at 2107 North First Street, San Jose, California.
Veeco Receives Multi-Tool Order
Veeco Instruments Inc. today announced that a manufacturer of optoelectronic components has ordered multiple Lumina Metal Organic Chemical Vapor Deposition (MOCVD) Systems for production of leading-edge photonics applications.
Kulicke & Soffa Expands Thermal Compression Bonding Capabilities to Accelerate Innovation in the Integration of Semiconductor and Silicon Photonics
Kulicke and Soffa Industries, Inc. announced it is expanding its Thermal Compression Bonding (TCB) capabilities to accelerate innovation in the integration of semiconductor and Silicon Photonics.
pSemi Introduces Complete 5G mmWave RF Front-End (RFFE) Solution
pSemi Corporation, a Murata company focused on semiconductor integration, announces the expansion of its millimeter wave (mmWave) RF front-end portfolio for 5G wireless infrastructure applications.
Cadence Appoints Mary Louise Krakauer to Board of Directors
Cadence Design Systems, Inc. announced the appointment of Mary Louise (ML) Krakauer to its board of directors, effective January 31, 2022.
SiTime Introduces XCalibur, a MEMS Solution for the Timing Industry’s Supply Chain Disruption
SiTime Corporation today introduced the SiTime XCalibur active resonator. This new product category solves supply chain constraints using programmable semiconductors to deliver a drop-in replacement for quartz crystal resonators.
Technique Smooths Path for AI Training in Wireless Devices
Federated learning is a great tool for training artificial intelligence (AI) systems while protecting data privacy, but the amount of data traffic involved has made it unwieldy for systems that include wireless devices. A new technique uses compression to drastically reduce the size of data transmissions, creating additional opportunities for AI training on wireless technologies.
Moov Announces Austin as HQ2
Moov, a data-fueled marketplace for used manufacturing equipment, today announced that Austin, Texas, will be the location of the company’s second headquarters.
Richardson Electronics, Ltd. Gives Designers More Flexibility with New Wide-Band Gap Band Technology
Richardson Electronics, Ltd. announces the availability of SemiQ’s 2nd generation silicon carbide power switches, 1200V 80mΩ SiC MOSFETs. These MOSFETs complement SemiQ’s existing SiC rectifiers at 650V, 1200V, and 1700V.
ClassOne Expands Engineering Team, Appoints Alia Doll as Director of Engineering
ClassOne Technology, a provider of high-performance semiconductor wet processing tools, today announced the appointment of Alia Doll (formerly with Micron Technology) as its new director of engineering.
