In its continuing efforts to discover and develop innovative technologies for the packaging industry, Amcor announced today its strategic investment in PragmatIC Semiconductor.
Intel Announces Next US Site with Landmark Investment in Ohio
Intel will invest more than $20 billion to build two new factories and to establish a new epicenter for advanced chipmaking in the Midwest.
NUS Research Team Sets New Efficiency Record for Solar Cell Technology
Their solar cells made using perovskite and organic materials achieve a power conversion efficiency of 23.6%, approaching that of conventional silicon solar cells.
DuPont Completes New Production Line in Circleville, Ohio
DuPont Interconnect Solutions, a business within the Electronics & Industrial segment, today announced it has completed the expansion project at its Circleville, Ohio manufacturing site.
Samco Unveils New Plasma Etching Cluster Tool for Compound Semiconductor Device Fabrication
Samco, a manufacturer of etching, deposition and surface treatment processing equipment for the semiconductor and related industries and academic facilities, is proud to introduce the new plasma etching cluster tool “Cluster H.”
Intevac Appoints Nigel Hunton as Chief Executive Officer
Intevac, Inc., a supplier of thin-film processing systems, today announced the appointment of Nigel Hunton as president and chief executive officer (CEO), and member of the board of directors, effective January 19th.
Quantum Tech: Semiconductor ‘Flipped’ to Insulator Above Room Temp
A semiconducting material that performed a quantum “flip” from a conductor to an insulator above room temperature has been developed at the University of Michigan.
Secure-IC Raises €20M to Accelerate the Development of Its Cybersecurity Solutions for Connected Objects
After 10 years of sustained and controlled growth on equity, Secure-IC, a provider of end-to-end cybersecurity solutions for embedded systems and connected objects announced today a first capital raising of 20 million euros.
Kandou Secures 2022 Supply Chain Capacity for USB4 Retimer Chips
Kandou today announced it has secured foundry capacity and backend IC packaging and testing services to meet all 2022 customer requirements for its Matterhorn USB-C multiprotocol retimer with USB4 support
AMD, Intel Display Chiplet Packaging Prowess
Last November AMD held their AMD Accelerated Data Center Premiere, Intel had their Innovation Days, and Stephen Shankland of CNET visited Intel’s fabs 42 and CH-4 in Chandler.
