Phononic Announces Full Customer and Manufacturing Qualification in APAC

Phononic, a developer of solid-state cooling and heating technology, today announced full customer qualification of manufacturing operations at Fabrinet, a provider of advanced optical packaging and precision optical, electro-mechanical and electronic manufacturing services.

Mobix Labs Opens Design Center in Australia

 Mobix Labs In., today announced it has opened a new design center in Sydney, Australia, with the hiring of a veteran team of engineers who have strong track records in the successful development and layout of radio frequency integrated circuits (RFICs).

Micron Announces Over $150 Billion in Global Manufacturing and R&D Investments to Address 2030 Era Memory Demand

Micron Technology, Inc. today announced that it intends to invest more than $150 billion globally over the next decade in leading-edge memory manufacturing and research and development (R&D), including potential U.S. fab expansion.

GlobalFoundries Announces Launch of Initial Public Offering

GlobalFoundries today announced the commencement of its initial public offering of 55,000,000 ordinary shares, 33,000,000 of which are being offered by GF and 22,000,000 of which are being offered by GF’s existing shareholder, Mubadala Investment Company PJSC, pursuant to a registration statement on Form F-1 filed with the U.S. Securities and Exchange Commission.

Wolfspeed and ZINSIGHT Enhance Efficiency in Fuel Cell Vehicles with Silicon Carbide Technology

Wolfspeed, Inc. today announced that ZINSIGHT Technology (Shanghai) Co., Ltd. will utilize Wolfspeed 1200V Silicon Carbide MOSFETs in its advanced motor controller for ultra-high-speed air compressors in fuel cell vehicle (FCV) engines.

Omni Design Announces Silicon Validated Data Converters on TSMC 16nm Process

Omni Design Technologies, a provider of high-performance, low-power mixed-signal Intellectual Property (IP) solutions, today announced the availability of silicon-validated 12-bit 6 Gsps analog-to-digital (ADC) and 12-bit 7 Gsps digital-to-analog (DAC) converters on TSMC’s 16nm process.

Dr. Walden “Wally” C. Rhines Tapped to Receive Global Semiconductor Alliance’s Highest Honor: Dr. Morris Chang Exemplary Leadership Award

Global Semiconductor Alliance (GSA) will honor industry luminary and prominent technologist, Dr. Walden “Wally” C. Rhines, with its prestigious Dr. Morris Chang Exemplary Leadership Award at its Annual Awards Celebration on December 9, 2021.

SEL-WLEDs: Full Electroluminescent White Light-Emitting Diodes Based on a Single Emissive Layer

Full-electroluminescent white light-emitting diode (WLED) technology is regarded as the best candidate for next-generation solid-state lighting source owing to its lower energy consumption than the current WLED based on blue LED chip and yellow phosphor.

TESCAN’s New Large Volume Workflow Significantly Speeds Sample Processing Time for Semiconductor Failure Analysis and Materials Research

TESCAN ORSAY HOLDING a.s. launches the new Large Volume Workflow for faster failure and defect root-cause analysis in semiconductor manufacturing and materials research.

Biomedical Engineering Researchers to Study Knee Re-Injury Risk Using Wearable Sensors

Each year, the number of people wearing smart watches increases, according to recent surveys. These wearable sensors are commonplace and provide useful feedback to individuals about their health. Wearable sensors can also be used in labs and clinics to gain real-time data and inform health decisions.