Brain-inspired computing is a promising candidate for next-generation computing technologies. Developing next-generation advanced artificial intelligence (AI) systems that can be as energy-efficient, lightweight, and adaptable as the human brain has attracted significant interest.
Voyager 1035: A Unique Combination of Deep Learning, Speed and Sensitivity
KLA’s new Voyager 1035 laser scanning patterned wafer inspector helps guide chip manufacturing by monitoring critical process steps during ramp and volume production.
Paragraf Appoints Charles Platts as CFO
Paragraf, a manufacturer in the development and production of graphene electronic devices, has appointed Charles Platts as Chief Finance Officer.
“How Long Will It Last?” Heightened Demand for Plating in Advanced Packaging & Front-End (FE)/Damascene Chemicals
Healthy growth through 2022, but softening expected in 2023.
Elements in Liquid Metals Compete to Win the Surface
For the first time, researchers at UNSW Sydney proposed that the phenomenon related to the surface competition between elements can be used as an approach for harvesting mixed metaloxide sheets that can be used in electronics.
Navitas and BRUSA Announce Development Partnership to Accelerate EV Adoption
Navitas Semiconductor and BRUSA HyPower AG announced a technology development partnership to accelerate EV adoption of Navitas GaN power ICs to reduce the size and weight of power electronic components that are used for EV charging.
New Technique Speeds Measurement of Ultrafast Pulses
University of Rochester researchers have developed a time-domain single-pixel imaging technique to speed the measurement of ultrafast pulses in infrared and far infrared wavelengths
ACM Research Ships Its First 300mm, High-Temp Single-Wafer SPM Tool for Advanced Logic, DRAM and 3D-NAND Semiconductor Manufacturing
ACM Research, Inc. today announced it has shipped its first 300mm single-wafer Sulfuric Peroxide Mixture systems for wet clean and etch processes in advanced logic, DRAM and 3D-NAND integrated circuit manufacturing.
Truphone Enables Mass IoT Deployments With iSim Collaboration
Truphone announces that in collaboration with Sony Semiconductor Israel and Kigen, Truphone has successfully enabled its IoT platform and global connectivity to run on the integrated SIM of Sony’s Altair cellular IoT chipsets, powered by Kigen iSIM OS.
Panel-Level Heterogeneous Integration Technology for Analog ICs
Micro-transfer printing, a massively parallel pick-and-place process, may be used to produce HI analog ICs comprised of large arrays of ultra-thin separately manufactured components interconnected using redistribution layer technology.
