MicroAI announced today that it has joined Silicon Labs’ Technology Partner Program and begun to collaborate to deliver the benefits of edge-native AI for Silicon Labs’ customers.
Ultra-efficient Tech to Power Devices of Tomorrow and Forge Sustainable Energy Future
Researchers from The Australian National University (ANU) have developed a system to transport data using atomically-thin semiconductors in a way that is extremely energy-efficient.
Cloud Energy Deploys Network Using LoRaWAN For Wireless Solar Power System Enabling Effective Energy Monitoring
Semtech Corporation, a supplier of high performance analog and mixed-signal semiconductors and advanced algorithms, announced its collaboration with Cloud Energy
Sivers Semiconductors Recruits New CFO
Sivers Semiconductors AB today announced that the company has recruited Håkan Rippe as new Chief Financial Officer (CFO) from September 20.
Cadence and Samsung Accelerate 3nm Mixed-Signal Silicon
Cadence Design Systems, Inc. today announced that it has collaborated with Samsung Foundry to deliver qualified Mixed-Signal OpenAccess-ready process design kit (PDK) technology files that support a range of Samsung process technologies from 28FDS to GAA base 3nm.
Samsung Receives Its First Global Carbon Footprint Certification for Logic Chips
Samsung Electronics Co., Ltd. today announced that four of its System LSI products received product carbon footprint label certification from the Carbon Trust, the first of Samsung’s logic chips to do so.
Weebit and SkyWater Announce Agreement to take ReRAM Technology to Volume Production
Weebit Nano Limited, a developer of next-generation memory technologies for the global semiconductor industry, and SkyWater Technology, the trusted technology realization partner, announced an agreement to take Weebit’s innovative Resistive RAM (ReRAM) technology to volume production.
Graphene Made with Lasers for Wearable Health Devices
Graphene, hexagonally arranged carbon atoms in a single layer with superior pliability and high conductivity, could advance flexible electronics according to a Penn State-led international research team.
New Applied Materials Technologies Help Leading Silicon Carbide Chipmakers Accelerate the Transition to 200mm Wafers and Increase Chip Performance and Power Efficiency
Applied Materials, Inc. today announced new products that help enable the world’s leading silicon carbide (SiC) chipmakers transition from 150mm wafer production to 200mm production, which approximately doubles die output per wafer, to help satisfy the world’s growing demand for premium electric vehicle powertrains.
Aviva Technology Holding Raises $26.5M Series A Financing to Accelerate Automotive Connectivity
Aviva Technology Holding today announced a $26.5 million Series A funding round led by Dr. Sehat Sutardja and Weili Dai (Founders of Marvell Technology Group) and other prominent semiconductor industry investors with participation from SAFE round investors.
