Increase in global adoption of AI and IoT, and rising deployment of data centers and high-performance computing are among the factors driving the growth of the FPGA market.
Pfeiffer Vacuum Introduces the Reliable and Low-Vibration HiPace 80 Neo Turbopump
Pfeiffer Vacuum presents its new HiPace 80 Neo turbopump, which features a longer life before service and reduced vibration and noise emissions.
Transphorm Announces the Close of JV Transaction for Acquisition of AFSW Wafer-Fab
Transphorm, Inc. announced today the close of the transaction for the acquisition of 100% interest in the Company’s AFSW wafer-fab facility by GaNovation, Transphorm’s recent joint venture with Palo Alto-based JCP Capital, a new strategic-financial partner.
Heterogeneous Epitaxy of Semiconductors Targeting the Post-Moore Era
A research team led by Prof. LIU Zhiqiang from the Institute of Semiconductors of the Chinese Academy of Sciences, in cooperation with the team led by Prof. GAO Peng from Peking University and the team led by Prof. LIU Zhongfan from Beijing Graphene Institute (BGI), recently realized the concept of “heterogeneous epitaxy” via a van der Walls strategy, a type of nonsymmetrical epitaxy process.
New Material Offers Ecofriendly Solution to Converting Waste Heat into Energy
A team of scientists from Northwestern University and Seoul National University in Korea now has demonstrated a high-performing thermoelectric material in a practical form that can be used in device development.
In-line Airborne Particle Sensing – A Streamlined Contamination Solution for Cleanroom Environments
The IPS relieves pains of traditional monitoring methods while simultaneously increasing tool time and improving yields.
Intel Accelerates Process and Packaging Innovations
Intel Corporation this week revealed one of the most detailed process and packaging technology roadmaps the company has ever provided, showcasing a series of foundational innovations that will power products through 2025 and beyond.
IC Insights Forecasts a 21% Surge in IC Unit Shipments This Year
A 21% jump would be the largest increase in IC unit shipments since the boom year of 2010.
Merck Launches New Green Solvents for Photoresist Removal in Chip Production
Merck today announced the launch of a new line of complementary green solvents for use in photolithographic processes in semiconductor manufacturing.
CVD Completes the Sale of its 555 North Research Place Facility
CVD Equipment Corporation today announced it closed on the sale of its facility located at 555 North Research Place, Central Islip, New York for the purchase price of $24,360,000.
