BrainChip Holdings Ltd today introduced the Akida Pico, the lowest power acceleration co-processor that enables the creation of very compact, ultra-low power, portable and intelligent devices for wearable and sensor integrated AI into consumer, healthcare, IoT, defense and wake-up applications.
eBeam Initiative Survey of Semiconductor Luminaries Predicts Photomask Market Growth and Increasing Investments in Mask Inspection and Multi-beam Mask Writing
Results of 13th annual Luminaries survey to be presented at live event held during SPIE Photomask Technology + EUV Lithography Conference.
Global Semiconductor Packaging Material Market Outlook Shows Return to Growth Starting in 2024
Powered by strong semiconductor demand across diverse end applications, the global semiconductor packaging materials market is expected to start a growth cycle with a 5.6% compound annual growth rate (CAGR) projected through 2028.
Georgia Tech to Use ClassOne Technology Solstice S8 Single-Wafer Wet Processing System for Advanced Packaging R&D
ClassOne to support establishment of 3D heterogeneous integration hub at Georgia Tech’s Institute for Matter and Systems
ASM Launches PE2O8 Silicon Carbide Epitaxy System
Today at the 2024 International Conference on Silicon Carbide and Related Materials, ASM International N.V. (Euronext Amsterdam: ASM) introduced the PE2O8 silicon carbide epitaxy system, a new, dual chamber, platform for silicon carbide (SiC) epitaxy (Epi).
RIBER Receives Order to Equip Autonomous Pilot Line for the Design and Manufacturing of Optical Devices in Europe
RIBER is announcing the sale of a fully automated MBE 412 cluster platform in Finland.
SWAP Hub Team Awarded CHIPS Act Funded Project
The Deptartment of Defense has announced that the Southwest Advanced Prototyping (SWAP) Hub based at Arizona State University (ASU) has been awarded $5M in funding by the CHIPS and Science Act for a Multi-MHz, High Density, Ultra-fast RADAR Power Convert project that will advance radar power systems in critical defense applications.
SEMI Consortium to Develop Cybersecurity Strategy and Roadmap for the Semiconductor Industry in NIST Framework
Seeking to strengthen the semiconductor industry’s resilience to cybersecurity threats, the global association SEMI today announced the creation of a strategic roadmap for cybersecurity implementation throughout the industry.
Sivers Semiconductors Receives CHIPS Act Funding Award from NEMC Hub
$6M award accelerates lab-to-fab development of critical chip technology.
NY CREATES Receives $4.7M National Science Foundation Grant to Launch Semiconductor Workforce Development Program
The New York Center for Research, Economic Advancement, Technology, Engineering, and Science (NY CREATES) announced today it has been awarded a $4.7 million grant from the National Science Foundation (NSF) to support the establishment of the Education Alliance for Semiconductor Experiential Learning (EASEL) program.
