Semiconductor design has progressively improved over the decades, and that will continue for the foreseeable future. Here are some fascinating trends that will likely shape the future of engineering at all stages of product development.
Intel Elects Andrea Goldsmith to Board of Directors
Intel Corporation today announced that Andrea Goldsmith, dean of engineering and applied science and professor of electrical and computer engineering at Princeton University, was elected to Intel’s board of directors, effective Sept. 1, 2021.
Researchers Discover a ‘Layer Hall Effect’ in a 2D Topological Axion Antiferromagnet
Researchers have discovered a “layer” Hall effect in a solid state chip constructed of antiferromagnetic manganese bismuth telluride.
Supplyframe Commodity Intelligence Quarterly Points to Increasing Risk and Supply Constraints for Manufacturers
The worldwide shortage of semiconductors is expected to last for years to come amid increasing risk and supply constraints.
Phononic Raises $50 Million Growth Financing from Goldman Sachs Asset Management
To support the global demand for Sustainable innovations that address climate change, Phononic, a developer of solid-state cooling and heating technology, today announced that it has secured a significant growth investment led by $50 million from the Sustainable Investing business within Goldman Sachs Asset Management (Goldman Sachs).
Unilumin and STMicroelectronics Jointly Develop LED Display Using ST’s 60GHz Contactless Connectivity Chip for Advanced Video Solutions
STMicroelectronics and Unilumin, a developer of LED displays based in China, today announced that they have worked together to develop a new Unilumin display using the ST60A2, ST’s 60GHz RF transceiver for advanced high-data-rate contactless-transfer solutions.
Main Attraction: Scientists Create World’s Thinnest Magnet
The development of an ultrathin magnet that operates at room temperature could lead to new applications in computing and electronics – such as high-density, compact spintronic memory devices – and new tools for the study of quantum physics.
TESCAN Launches Next Generation AutoSlicer Module for High Throughput TEM Sample Preparation
TESCAN ORSAY HOLDING a.s. announces its latest generation AutoSlicer module for unattended, semi-automated transmission electron microscope (TEM) lamella preparation in semiconductor failure analysis and materials science.
NVIDIA Inference Breakthrough Makes Conversational AI Smarter, More Interactive From Cloud to Edge
NVIDIA today launched TensorRT 8, the eighth generation of the company’s AI software, which slashes inference time in half for language queries — enabling developers to build the world’s best-performing search engines, ad recommendations and chatbots and offer them from the cloud to the edge.
NXP Semiconductors and MOTER Technologies Join Forces to Extend Connected Vehicle Insurance Opportunities
NXP Semiconductors N.V. and MOTER Technologies have announced a secure data exchange platform that links deep data from connected vehicles to the insurance industry to power data science solutions for risk assessment, cost modeling, and more.
