The STMicroelectronics TSV7722 precision high-bandwidth operational amplifier, with gain-bandwidth of 22MHz and slew rate of 11V/μs, is well-suited for high-speed signal conditioning and accurate current measurement in power-conversion circuits and optical sensors.
Kneron Enters The Autonomous Car Race
Kneron, an AI chip and software developer, has entered the autonomous car race with a number of strategic partnerships.
Samsung Develops Industry’s First HKMG-Based DDR5 Memory; Ideal for Bandwidth-Intensive Advanced Computing Applications
Samsung Electronics Co. today announced that it has expanded its DDR5 DRAM memory portfolio with the industry’s first 512GB DDR5 module based on High-K Metal Gate (HKMG) process technology.
Semiconductor Materials Supply-Chain Shortages
TECHCET CA LLC’s prediction of a wet chemical supply fallout is materializing.
CHIPS Alliance and RISC-V International Invite the RISC-V Community to Participate in Updating a New Unified Memory Architecture Standard
New joint working group will enhance the OmniXtend Cache Coherency architecture.
What’s in the March Issue?
Each issue of Semiconductor Digest has articles found only in the magazine! Read the March issue…
Intevac Announces MATRIX Order for Fan-Out Applications in the Advanced Semiconductor Packaging Market
Intevac, Inc. today announced an INTEVAC MATRIX PVD order for fan-out applications in the advanced semiconductor packaging market.
Cadence Successfully Tapes Out Tensilica SoC on GLOBALFOUNDRIES 22FDX Platform Using Adaptive Body Bias Feature
Cadence Design Systems, Inc. today announced that it has collaborated with GLOBALFOUNDRIES to successfully tape out a Cadence Tensilica test chip on GF’s 22FDX platform.
Intel Launches ‘IDM 2.0’ Strategy, Including Two New U.S. Fabs and Foundry Services
Intel’s new CEO Pat Gelsinger announced significant manufacturing expansion plans, starting with an estimated $20 billion investment to build two new factories fabs in Arizona. He also announced Intel’s plans to become a major provider of foundry capacity in the U.S. and Europe to serve customers globally.
Texas A&M Researchers Optimize Materials Design Using Computational Technologies
Funded by the National Science Foundation (NSF), researchers at Texas A&M University are using advanced computational and machine-learning techniques to create a framework capable of optimizing the process of developing materials, cutting time and costs.
