Fully connected, data-driven, self-optimizing: in Dresden, Bosch is opening one of the world’s most modern wafer fabs.
A Collaborative Approach for Automotive Electronics
Collaboration along the supply chain, focused on common issues that emerge out of the dynamic electronics market and changing automotive ecosystem, will identify and drive improvements in the interest of the whole supply chain.
Texas Instruments Continues As World’s Top Analog IC Supplier
Skyworks Solutions posts strongest sales increase in 2020 as the top-10 suppliers collectively accounted for 62% of total analog sales.
SmartDV Announces Support for ARINC Standards with Design and Verification IP
SmartDV Technologies today announced support of the ARINC standards with its Design and Verification IP.
The Biodegradable Battery
The fabrication device for the battery revolution looks quite unconspicuous: it is a modified, commercially available 3D printer, located in a room in the Empa laboratory building. But the real innovation lies within the recipe for the gelatinous inks this printer can dispense onto a surface.
IEEE International Electron Devices Meeting Announces 2021 Call for Papers
Under the theme “Devices for a New Era of Electronics: From 2D Materials to 3D Architectures,” the 67th annual IEEE International Electron Devices Meeting (IEDM) has issued a Call for Papers seeking the world’s best original work in all areas of microelectronics research and development.
Imec Joins Forces With Sivers Photonics and ASM AMICRA
imec, together with Sivers Photonics and ASM AMICRA Microtechnologies, announced the successful wafer-scale integration of indium-phosphide (InP) distributed feedback (DFB) lasers from Sivers’ InP100 platform onto imec’s silicon photonics platform (iSiPP).
Mitigation of Pattern Collapse in EUVL
Rinse materials offer benefits of pattern collapse mitigation and defect improvement and, therefore, superior process margins for yield improvement. Defectivity is also significantly improved with an EUV rinse.
Intel 144-Tier Three-deck FG NAND with 161 Total Gates
A new 3D QLC NAND product has just arrived. TechInsights has quickly reviewed the Intel 1Tb QLC die removed from SSD 670p series which use 144L 3D NAND devices.
Acorn Technologies Prevails at Trial in Patent Infringement Lawsuit Against Samsung
Acorn Technologies today announced that a jury has found that Samsung Electronics Co., Ltd. infringed all asserted claims of four semiconductor-related patents at a recent trial in the U.S. District Court for the Eastern District of Texas.
