It is a milestone on the path to the chip factory of the future: at the new Bosch semiconductor fab in Dresden, silicon wafers are passing through the fully automated fabrication process for the first time.
CEA-Leti Envisions Widespread Use of LiDAR Systems Based on Integrated Optical Phased Arrays (OPAs)
Taking a critical step toward developing LiDAR systems for widespread commercial applications, CEA-Leti has developed genetic algorithms to calibrate high-channel-count optical phased arrays (OPAs), as well as an advanced measurement setup enabling wafer-scale OPA characterization.
Honoring Bill Tobey
I have some sad news to share. Industry pioneer and legend Aubrey “Bill” Tobey passed away on March 1st. He was a good friend and a great supporter of The ConFab event that we produced.
Revenue per Wafer Climbs as Demand Surges for 5nm/7nm IC Processes
Despite high development costs, smaller nodes bring greater revenue per wafer.
Merck KGaA, Darmstadt, Germany Moves the Silicon Valley Innovation Hub to San Jose’s Intermolecular Site
Merck KGaA, Darmstadt, Germany, a leading science and technology company, has moved its Silicon Valley Innovation Hub team to San Jose’s Intermolecular’s 150,000 sqft facility, creating a unique space for innovation and collaboration at the intersection of life science, healthcare and electronic materials.
BrainChip’s Success in 2020 Advances Fields of On-Chip Learning and Ultra-Low Power Edge AI
BrainChip Holdings Ltd. ended the 2020 calendar year having made significant strides in the development of its technology backed by the launch of its Early Access Program (EAP), availability of Akida evaluation boards, new partnerships, and expansion of its executive leadership and global facilities.
Semtech to Enable 50Gbps PAM4 Front Haul 5G Wireless Deployment with Industry’s First 5G Front Haul Tri-Edge CDR IC Solution
Semtech Corporation (Nasdaq: SMTC), a leading supplier of high performance analog and mixed-signal semiconductors and advanced algorithms, today announced sampling of a new solution (GN2255), Semtech’s Tri-Edge CDR to enable emerging 50Gbps PAM4 5G front haul deployments.
IAR Systems Announces Availability of RISC-V Development Tools with Certification for IEC 61508 and ISO 26262
IAR Systems, the future-proof supplier of software tools and services for embedded development, announces the availability of a certified edition of its development toolchain for RISC-V.
proteanTecs Joins the TSMC IP Alliance Program
proteanTecs, a leading provider of health and performance monitoring solutions for advanced electronics, today announced it has joined the TSMC IP Alliance Program, a key component of TSMC’s Open Innovation Platform (OIP).
Heat-Free Optical Switch Would Enable Optical Quantum Computing Chips
In a potential boost for quantum computing and communication, a European research collaboration reported a new method of controlling and manipulating single photons without generating heat. The solution makes it possible to integrate optical switches and single-photon detectors in a single chip.
