RAPTOR technology exceeds the performance of traditional tampering detection methods by up to 40%.
TD Shepherd Joins the Silicon Catalyst In-Kind Partner Ecosystem
Silicon Catalyst IKPs provide technical and business support to the Portfolio Companies in the incubator + accelerator, enabling them to tap into the products and services available to enhance the growth of their companies.
Arm Announces Appointment of Young Sohn to its Board of Directors
Arm today announced the appointment of new Board member Young Sohn.
SkyWater Names Bassel Haddad as Sr. Vice President and General Manager of Advanced Packaging
SkyWater Technology today announced the appointment of Bassel Haddad as senior vice president and general manager of advanced packaging.
Intel Awarded up to $3B by the Biden-Harris Administration for Secure Enclave
The Biden-Harris Administration announced today that Intel Corporation has been awarded up to $3 billion in direct funding under the CHIPS and Science Act for the Secure Enclave program.
NHanced Semiconductors President Robert Patti to Deliver Keynote at IEEE 3DIC Conference in Sendai, Japan
At the upcoming IEEE International 3D Systems Integration Conference (3DIC), NHanced Semiconductors president Robert Patti will deliver a keynote address detailing the critical role of advanced packaging in continuing the progress of Moore’s Law in semiconductor development.
ETRI Succeeds in the Development of a p-type Semiconductor Material to Lead Semiconductor Innovation
A group of Korean researchers have recently succeeded in developing new p-type semiconductor materials and thin-film transistors that will lead the innovation of the semiconductor industry.
Heidelberg Instruments Reports Several Installations of its ULTRA Semiconductor Mask Writer as Global Semiconductor Demand Surges
Heidelberg Instruments, a provider of advanced laser lithography systems, is pleased to announce a continued stream of orders for the ULTRA Semiconductor Mask Writer from photomask production groups across the US and Asia.
Dr. Jason Cong to be Honored With 2024 Phil Kaufman Award
Dr. Jason Cong, Distinguished Professor and Volgenau Chair for Engineering Excellence at the University of California, Los Angeles (UCLA), will be honored with the 2024 Phil Kaufman Award for distinguished contributions to Electronic System Design (ESD).
Polymatech and ECM Group Forge Strategic Joint Venture for Semiconductor Wafer Fabrication in Grenoble, France
The new venture will focus on producing sapphire ingots and wafers, key materials for advanced semiconductor devices.
