Universal Display Corporation to Present Next Generation OLED Platform Technology Developments at SID Display Week

Universal Display Corporation (Nasdaq: OLED), today announced that the Company will present at the Society for Information Display (SID) Display Week 2021 International Symposium, Seminar and Exhibition being held virtually May 17-21.

Xpeedic On-Chip Passive EM Simulation Suite Certified for Samsung Foundry 8LPP Process Technology

Xpeedic today announced that its on-chip passive EM simulation suite has been certified by Samsung Foundry for its advanced 8LPP (8nm Low Power Plus) process technology.

Reno Sub-Systems Launches GenMatch Series of Integrated RF Power Systems for Semiconductor Manufacturing at 7nm or Below

Reno Sub-Systems (Reno), a developer of high performance radio frequency (RF) matching networks for leading-edge nanoscale semiconductor manufacturing, today introduced its new GenMatch Series that integrates the company’s proven solid-state Electronic Variable Capacitor (EVC) RF match and Precis generator technologies into a single unit.

Ignion Rebrand Marks New Era for IoT Technology With its Virtual Antenna

Inspired by wide adoption of its Virtual Antenna for IoT devices, Fractus Antennas has rebranded as Ignion, a change that marks a new era of expansion and growth.

The Chip Shortage Wake-up Call

An extreme hypothetical scenario of complete disruption of Taiwanese foundries for one year could cause the global electronics supply chain to come to a halt.

Kioxia Announces Expansion of Yokohama Technology Campus and New Research Center

Kioxia Corporation today announced a 20 billion yen investment to expand its Technology Development Building at its Yokohama Technology Campus and to establish its new Shin-Koyasu Advanced Research Center.

Tiny, Wireless, Injectable Chips Use Ultrasound to Monitor Body Processes

Columbia Engineers develop the smallest single-chip system that is a complete functioning electronic circuit; implantable chips visible only in a microscope point the way to developing chips that can be injected into the body with a hypodermic needle.

MasterGaN Reference Design from STMicroelectronics Demonstrates Heatsink-Free 250W Resonant Converter

STMicroelectronics has released the first reference design for its MasterGaN power packages, demonstrating how the new highly integrated devices increase power density, boost energy efficiency, simplify design, and accelerate time to market.

Semiconductor Industry and Downstream Sector Leaders Form Coalition to Secure Federal Investments in Domestic Chip Manufacturing and Research

In letter to congressional leaders, new Semiconductors in America Coalition urges enactment of plan to allocate $50 billion to fund the CHIPS for America Act.

Brewer Science Announces Launch of the American Materials Technology Partnership

Brewer Science announced the establishment of the American Materials Technology Partnership.