Mixed-cation single crystals narrow the gap between perovskite and top-performing semiconductor solar cells. A synthetic approach that improves absorber layers in perovskite solar cells could help them achieve their full potential and draw closer to the performance of leading gallium arsenide devices.
Trelleborg Launches its ‘Fab Four’ FFKM Materials for the Most Critical Semiconductor Sealing Applications
Trelleborg Sealing Solutions launches four materials in its Isolast PureFab range, specifically engineered for critical semiconductor sealing applications.
3D-Micromac Signs MOU with dpiX to Formalize Partnership
dpiX and 3D-Micromac America today announced the signing of a Memorandum of Understanding (MOU) that outlines the companies’ cooperation in the development, prototyping and manufacturing of laser-manufactured, flat-panel semiconductors.
Semtech and EchoStar Mobile to Test Satellite IoT Connectivity Service Integrated With LoRaWAN
Semtech Corporation and EchoStar Corporation announced the launch of an initiative to test satellite connectivity services enabled by the LoRaWAN protocol.
Dialog Semiconductor Leads Industrial Digital Transformation with Addition of AI and Data Analytics Partners to SmartServer Ecosystem
Dialog Semiconductor plc announced an expansion of its SmartServer IoT Partner Program to include businesses that offer data analytics platforms with artificial intelligence (AI)-led outcomes that transform industrial operations.
MIPI Alliance Releases Specifications to Streamline Integration of In-Vehicle Displays, Add Functional Safety to Display Data Streams
The MIPI Alliance, an international organization that develops interface specifications for mobile and mobile-influenced industries, announced the completion of its MIPI Automotive SerDes Solutions (MASS) “display stack.”
Gel-Pak Collaborates with BAE Systems on Packaging Solution for Thin Semiconductor Devices
Gel-Pak, a division of Delphon and a manufacturer of protective device carrier and film products for the semiconductor and optoelectronics industries announces its collaboration with BAE Systems on a new product called the Lid/Clip Super System (LCS2).
Q1 Global Semiconductor Sales Increase 3.6% Over Previous Quarter
Worldwide sales for March increase 17.8% year-to-year, 3.7% month-to-month.
Silicon Wafer Shipments Edge Higher in First Quarter 2021 to Set New Record, SEMI Reports
Worldwide silicon wafer area shipments increased 4% to 3,337 million square inches in the first quarter of 2021 compared to the fourth quarter of 2020, topping the previous historical high set in the third quarter of 2018, according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.
Silicon Integration Initiative Targets New Silicon Carbide Standard SPICE Model
The Si2 Compact Model Coalition has voted to fund and standardize a SPICE model for silicon carbide-based metal-on-silicon field-effect transistors.
