Our world needs reliable telecommunications more than ever before. However, classic devices have limitations in terms of size and cost and, especially, power consumption – which is directly related to greenhouse emissions. Graphene could change this and transform the future of broadband. Now, Graphene Flagship researchers have devised a wafer-scale fabrication technology that, thanks to predetermined graphene single-crystal templates, allows for integration into silicon wafers, enabling automation and paving the way to large scale production.
CHIPS Alliance Brings on Rob Mains as New Executive Director
CHIPS Alliance, the leading consortium advancing common and open hardware for interfaces, processors and systems, today announced the appointment of Rob Mains as the organization’s new executive director. Rob has over 35 years of experience in software engineering and development,…
A*STAR’s Institute of Microelectronics Partners Eight Semiconductor Companies in Chip-to-Wafer Hybrid Bonding Consortium
A*STAR’s Institute of Microelectronics (IME) has partnered leading semiconductor companies to develop Chip-to-Wafer (C2W) Hybrid Bonding for high density 2.5D and 3D integrated circuit (IC) integration. The newly formed pre-competitive C2W Hybrid Bonding Consortium with international and local industry supply chain companies will leverage IME’s expertise in 2.5D and 3D IC integration and bonding technologies for the development of C2W hybrid bonding process and demonstration of 4 chips stacking with ≤10um pitch interconnections. Refer to ANNEX A for the full list of consortium members.
UniKLasers Launch World’s First Laser to Operate with 349nm Single Frequency
UniKLasers Limited, a leading manufacturer of high precision scientific laser instrumentation, has launched its new ultra-violet (UV) laser – The Duetto 349 – a single frequency DPSS CW device which emits at 349 nanometres (nm) with a 50 mW output – making it the world’s first laser to operate with single frequency at 349 nm.
USABC Awards $732,448 Battery Technology Assessment Program Contract to Nanoramic Laboratories
The United States Advanced Battery Consortium LLC (USABC), a subsidiary of the United States Council for Automotive Research LLC (USCAR), today announced the award of a $732,448 technology assessment program contract to Nanoramic Laboratories in Boston, Massachusetts to demonstrate Nanoramic’s high energy and power density lithium-ion battery based on polymer binder-free electrode technology in electric vehicle (EV) applications.
Adapdix Announces SoftBank Funding for Next-Generation Edge AI Platform
Adapdix Corporation, the digital transformation leader in Edge AI automation and intelligent control software, today announced that it has received funding from SoftBank’s Opportunity Fund, pushing the total investment amount secured by Adapdix up to $10 million.
Mouser Stocks Industry’s Widest Selection of Products
Mouser Electronics, Inc. is the industry’s leading authorized New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components.
CEA-Leti Team Paves the Way for Massive Integration of Qubits, Critical for Achieving Quantum Supremacy
CEA-Leti scientists have opened a pathway to large-scale integration of Si-spin qubits using existing flip-chip processes with die-to-wafer 3D-interconnect technologies developed in-house.
Sensible 4 Tested Autonomous Driving Software in Finnish Lapland
Finnish self-driving technology company was testing its software in the Lapland of Finland for 2,5 weeks. The Temperature went even below -20°C, visibility distance was short, and roads were covered in snow – in other words, conditions were perfect for testing autonomous vehicles.
Imec Demonstrates 20nm Pitch Line/Space Resist Imaging with High-NA EUV Interference Lithography
Imec reports for the first time the use of a 13.5 nm High Harmonic Generation source for the printing of 20nm pitch line/spaces using interference lithographic imaging of an Inpria metal-oxide resist under high-numerical-aperture (high-NA) conditions.
