Kulicke & Soffa Further Extends Mini and Micro LED Technology Through Strategic Acquisition of Uniqarta

Kulicke and Soffa Industries, Inc. announced today it has acquired a 100% equity stake in Uniqarta, Inc, a technology company headquartered in Cambridge, Massachusetts, USA.

Quasicrystal-Clear: Material Reveals Unique Shifting Surface Structure Under Microscope

Scientists reveal peculiar surface structure in materials resembling quasicrystals with interesting implications for its magnetic properties.

CEA-Leti Announces EU Project to Create Dynamically Programmable Wireless 6G Environments

CEA-Leti today announced a visionary EU 6G research project for next-generation wireless connectivity. Called RISE-6G, it will design, prototype and test smart and energy-sustainable technological advances based on reconfigurable intelligent surfaces (RIS) that will enable programmable control and shaping of the wireless propagation environment.

ASM Pacific Technology and EV Group Join Forces to Enable Industry’s First Ultra Precision Die-to-Wafer Hybrid Bonding Solutions for 3D-IC Heterogeneous Integration

ASM PACIFIC TECHNOLOGY (ASM) and EV GROUP (EVG) announced the signing of a joint development agreement (JDA) to co-develop die-to-wafer hybrid bonding solutions for 3D-IC/heterogeneous integration applications.

ICYMI – Intel Shows Early Ponte Vecchio Part

Occasionally, we will see something in the media that we think worth commenting on, and post as an “In Case You Missed It” (ICYMI) blog. In this case, it was a Jan 26 Twitter post by Intel’s Raja Koduri (@rajaonthe edge), showing a complex multi-die part that appears to be the Ponte Vecchio high-end GPU, announced by Raja in his keynote at the Intel HPC Developer Conference just before SuperComputing 2019.

Renesas and Dialog Semiconductor to Join Forces to Advance Global Leadership in Embedded Solutions

Renesas Electronics Corporation and Dialog Semiconductor Plc announced they have reached an agreement on the terms of a recommended all-cash acquisition by Renesas of the entire issued and to be issued share capital of Dialog (the “Acquisition”) for EUR 67.50 per share, representing a total equity value of approximately EUR 4.9 billion (approximately 615.7 billion yen).

Brightening the Future of Semiconductor-Based Photocatalytic Processes

A collaboration between the Pericàs group with Prof. Timothy Noël and Dr. Paola Riente at the Eindhoven University of Technology (TU/e, The Netherlands), has crystallised in a Nature Communications paper where they provide key insight into the chemical nature of the true photocatalyst involved in the Bi2O3-driven atom-transfer radical addition (ATRA) reaction.

Total MPU Sales Surprise with Strong Gains in 2020, More Upside in 2021

IC Insights recently released its 2021 edition of The McClean Report. The new analysis and forecast of the IC industry includes an analysis and forecast of the total microprocessor (MPU) market, including computer CPUs for PCs, tablets, and servers, embedded MPUs, and cellphone application MPUs.

Top-10 IC Growth Categories Target Emerging Applications in 2021

Each of the top-10 growing IC product categories is expected to see a double-digit increase in sales, but only the top-five segments are forecast to grow faster than the total IC market, which IC Insights projects will rise 12% this year.

Global Semiconductor Sales Increase 6.5% to $439 billion in 2020

The Semiconductor Industry Association (SIA) today announced the global semiconductor industry sales were $439.0 billion in 2020, an increase of 6.5% compared to the 2019 total of $412.3 billion.