White House Chip Summit Builds Momentum for Federal Investments in U.S. Chip Manufacturing and Research

The Semiconductor Industry Association (SIA) today released the following statement from President and CEO John Neuffer regarding today’s meeting at the White House between Biden Administration officials and leaders from the semiconductor industry and other sectors to discuss the global chip shortage, President Biden’s infrastructure plan, and other issues related to the semiconductor supply chain.

Study Could Lead to Production of More Efficient Optoelectronic Devices

Resonant-tunneling diodes are used in high-frequency oscillators, wave emitters and detectors, logic gates, photodetectors, and optoelectronic circuits. The study was a collaboration between Brazilian and German researchers.

First Automotive-Qualified, Single-Chip Solution for Large, Ultrawide Touch Displays now Available

To better meet the need for safe, intuitive and easy-to-use user interfaces within automotive vehicles, designers are continuing to consolidate the vehicle’s cluster, center stack and co-driver displays into very wide screens.

CEA-Leti Announces EU Project to Mimic Multi-Timescale Processing of Biological Neural Systems

CEA-Leti announced today the launch of an EU project to develop a novel class of algorithms, devices and circuits that reproduce multi-timescale processing of biological neural systems.

SEMI Appoints imec and Soitec Executives as Chairs of SEMI Europe Advisory Board

SEMI today announced the appointments of Luc Van den hove, president and CEO of imec, as chair and Paul Boudre, CEO of Soitec, as vice chair of the SEMI Europe Advisory Board.

Protect Valuable Drive Technology with Pfannenberg Thermal Management and Filter Technology

Pfannenberg, Inc., a global manufacturer of thermal management technologies, announces that it is possible to protect valuable investments in drive technology through the use of thermal management and filter products.

Cadence Pegasus Verification System Certified for Samsung Foundry 5nm and 7nm Process Technologies

Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that the Cadence Pegasus Verification System has achieved certification for Samsung Foundry’s 5nm and 7nm process technologies.

Understanding Interfaces of Hybrid Materials with Machine Learning

The production of nanomaterials involves self-assembly processes of functionalized (organic) molecules on inorganic surfaces. This combination of organic and inorganic components is essential for applications in organic electronics and other areas of nanotechnology.

Gate-All-Around Transistors Show up at ISSCC

The International Solid-State Circuits Conference was held virtually last month from February 13th – 22nd, 205 papers in 35 sessions, with industrial participation from Analog Devices, Broadcom, Huawei Technologies, IBM, Intel, Qualcomm, Realtek Semiconductor, Renesas, Samsung, Sony, SK Hynix, STMicroelectronics, TSMC, Texas Instruments, and more.

SEMI and Center for Automotive Research Announce Collaboration

SEMI, the largest global trade association for the design and manufacture of semiconductors, and the Center for Automotive Research (CAR), a 501(c)(3) nonprofit independent automotive/mobility industry think tank, today announced the signing of a Memorandum of Understanding (MOU) for joint exploration to advance increased supply chain collaboration between the semiconductor and automotive industries.