GaN Systems announced today the release of the industry’s smallest 100W dual USB-C intelligent PD GaN charger.
Former Foxconn VP Richard Vincent Joins Adapdix as Chief Revenue Officer to Drive Expansion of Edge AI Platform
Adapdix Corporation, the leader in EdgeOps automation software, today announced that it has appointed Richard Vincent as Chief Revenue Officer (CRO).
Targeting Cancer Detection & Identification of Microorganisms, CEA-Leti Develops Mid-Infrared, Spectral-Imaging Technique
CEA-Leti scientists have developed a lensless, infrared spectral-imaging system for medical diagnostics.
Isolated Gate Driver from STMicroelectronics Safely Controls Silicon-Carbide MOSFETs
Joining STMicroelectronics’ STGAP family of isolated gate drivers, the STGAP2SiCS is optimized for safe control of silicon carbide (SiC) MOSFETs and operates from a high-voltage rail up to 1200V.
ACM Research Broadens Furnace Semiconductor Equipment Portfolio to Support Additional Logic, Memory and Power Device Manufacturing Processes
Highly configurable dry processing system adds un-doped and doped poly LPCVD, high-temperature oxidation and annealing capabilities.
Samsung and TSMC Seeking to Spend Their Way to Worldwide Domination of Advanced IC Technology
Combined, the two companies are forecast to represent 43% of global semiconductor industry capital spending this year.
James Mitarotonda Joins Rambus Board of Directors
Rambus Inc. today announced that James Mitarotonda joined its Board of Directors as a Class I director with a term expiring at Rambus’ 2022 annual meeting of stockholders.
Catching Electrons in Action in an Antiferromagnetic Nanowire
In a study published in Nano Letters, physicists from Michigan Technological University explore alternative materials to improve capacity and shrink the size of digital data storage technologies. Ranjit Pati, professor of physics at Michigan Tech, led the study and explains the physics behind his team’s new nanowire design.
CAD Design Software Introduces Four New Electronics Packaging Designer (EPD) Suites Powered by AutoCAD OEM
CAD Design Software (CDS), a leader in Electronic Design Automation (EDA) software solutions, today announces the creation of four new Electronics Packaging Designer (EPD) suites, EPD for Windows Suites, powered by AutoCAD OEM.
Boston Semi Equipment Receives Multiple Repeat MEMS Pressure Sensor and High Voltage Power IC Test Handler Orders from Automotive Chip Companies
Boston Semi Equipment announced today it received repeat orders from automotive customers for multiple Zeus gravity test handlers configured for MEMS pressure and high power IC testing applications.
