ZEISS, TRUMPF and Fraunhofer Research Team Awarded the Deutscher Zukunftspreis 2020 for the Development of EUV Lithography

The German Federal President Frank-Walter Steinmeier announced the winners of the Deutscher Zukunftspreis 2020 (German Future Prize 2020) in a ceremony in Berlin today.

Microlight3D Unveils Smart Print-UV, a New Maskless Lithography System Equipped With UV Light

Microlight3D, a specialty manufacturer of high-resolution micro-scale 2D & 3D printing systems for industrial and scientific applications, today unveils Smart Print-UV (SP-UV), a new maskless lithography system equipped with a UV light source.

Game Changer in Thermoelectric Materials Could Unlock Body-Heat Powered Personal Devices

A new University of Wollongong study overcomes a major challenge of thermoelectric materials, which can convert heat into electricity and vice versa, improving conversion efficiency by more than 60%.

STMicroelectronics and Advantest Collaborate on Advanced Automated Test Cell for IC Testing

Semiconductor test equipment supplier Advantest Corporation and STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, announced that they have jointly developed an advanced, fully-automated final-test cell system that improves overall equipment efficiency and quality in semiconductor test and packaging operations.

Intel Looks Ahead to Stacked Nano-Ribbon Transistors, Anti-Ferroelectric E-DRAM at IEDM

Thanks to Covid-19, IEDM goes virtual this year, over the weeks of December 5 – 18th. After scanning through the advance program, and the tipsheet, a couple of papers from Intel caught my eye, one on complementary stacked nanoribbon transistors, and the other detailing embedded DRAM using anti-ferroelectric (AFE) capacitors.

SEMI Applauds Launch of EU Pact for Skills to Mobilize 2 Billion Euro Investment in Microelectronics Talent

SEMI, the global industry association representing the electronics manufacturing and design supply chain, today announced strong support for the Pact for Skills launched by European Commissioners Nicolas Schmit and Thierry Breton to help reskill and upskill Europe’s microelectronics industry talent in the coming years.

TechSearch International Examines HBM Growth and Package Options for HBM + Logic

The market for high bandwidth memory (HBM) is projected to grow 49% in wafers, including DRAM and logic layers, from 2020 to 2024.

proteanTecs CEO to Present Universal Chip Telemetry at the Taiwan Semiconductor Executive Summit (TSES)

proteanTecs, a developer of Deep Data solutions for electronics’ health and performance monitoring, will present at the Taiwan Semiconductor Executive Summit (TSES), taking place in Hsinchu on December 1-2, 2020.

Keysight Expands European Distribution Channel

Keysight Technologies, Inc., a technology company that helps enterprises, service providers and governments accelerate innovation to connect and secure the world, announced the addition of two new partners – Batronix and Batter Fly – to the company’s expanding European distribution network.

Stanford Scientists Invent Ultrafast Way To Manufacture Perovskite Solar Modules

Most solar cells today are made with refined silicon that turns sunlight into clean electricity. Unfortunately, the process of refining silicon is far from clean, requiring vast amounts of energy from carbon-emitting power plants.