While chipmakers are moving ahead with technology generations, maintaining the same timeline for scaling transistors in the front-end-of-line (FEOL), contacts and interconnects in the middle- (MOL) and back-end-of-line (BEOL) has become challenging.
Advanced Analysis Software Maximizes OmniScan Users’ Weld Analysis Capabilities
Olympus’ release of its WeldSight companion PC software for the OmniScan X3 phased array flaw detector provides inspectors with powerful tools to push the boundaries of flaw characterization and sizing.
Breaking The Power And Speed Limit of Lasers
Researchers at the George Washington University have developed a new design of vertical-cavity surface-emitting laser (VCSEL) that demonstrates record-fast temporal bandwidth.
New Insights Into Memristive Devices by Combining Incipient Ferroelectrics and Graphene
Scientists are working on new materials to create neuromorphic computers, with a design based on the human brain.
ACM Research Enters 3D TSV Copper Plating Market with Ultra ECP 3d Platform
ACM Research, Inc., a supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, today introduced its Ultra ECP 3d platform for conformally filled 3D through-silicon via (TSV) applications.
North American Semiconductor Equipment Industry Posts October 2020 Billings
Following the record-breaking September results, billings of North America-based semiconductor equipment manufacturers continue to show strong results in October.
It’s Time to Boost U.S. Manufacturing
There is a newfound interest in revitalizing semiconductor manufacturing in the U.S.
Xilinx Collaborates With Texas Instruments to Develop Energy Efficient 5G Radio Solutions
Xilinx, Inc. (NASDAQ: XLNX) today announced a collaboration with Texas Instruments (TI) to develop scalable and adaptable digital front-end (DFE) solutions to increase energy efficiency of lower antenna count radios.
ams Introduces Small Form-factor Color and Flicker Detection Sensor Optimized for Bezel-less and Ultra-narrow Bezel Smartphones
ams, a worldwide supplier of high performance sensor solutions, today releases the TCS3410, a combined ambient light/RGB color and flicker detection sensor with a tiny 2 mm x 1 mm footprint, further expanding customer options for use in their bezel-less and ultra-narrow bezel smartphones.
Alchip Technology Announces Record Q3 Earnings
Alchip Technologies third quarter of 2020 achieved a record net income $7.87 million on record revenue of $67.68 million. The company also reported continued growth in the high-performance computing market segment.
