A look inside YMTC’s second-generation 3D-NAND technology, which uses “Xtacking” to bond the peripheral circuitry face-to-face with the memory array instead of alongside.
Semiconductor Manufacturing Equipment Market is Projected to Reach USD 80 billion by 2026
According to a recent study from market research firm Global Market Insights, The adoption of technologies like AI and IoT in fabrication will significantly impact the semiconductor manufacturing equipment market forecast. Software companies are keen on implementing advanced solutions to cater to the rising demands of compact chipsets and growing production.
Yes, We CAN Preserve Personal Privacy in Voice-First Consumer Devices
A better balance between cloud and edge processing is a better balance between convenience and privacy, and that’s a win for everyone.
Epitaxy: An Epic Growth
Epitaxy growth equipment for More than Moore devices technology.
VLSI Design Optimization and Validation Process Is Like Painting the Forth Bridge
Some EDA tools have introduced an innovative approach that allows designers to generate design metadata one time for certain verification flows.
BrainChip and VORAGO Technologies Agree to Collaborate through the Akida Early Access Program
BrainChip Holdings Ltd, a leading provider of ultra-low power high performance AI technology, today announced that VORAGO Technologies has signed the Akida Early Access Program Agreement.
Kneron Boosts On-Device Edge AI Computing Performance With Cadence Tensilica IP
Cadence Design Systems, Inc. today announced that Kneron, a leading provider of on-device edge AI solutions, has integrated the Cadence Tensilica Vision P6 DSP in its next-generation KL720, a 1.4TOPS AI system-on-chip (SoC) targeted for AI of things (AIoT), smart home, smart surveillance, security, robotics and industrial control applications.
Understanding Cooling and Particulate Contamination Challenges for Next Generation ALE Technologies
Mixed-refrigerant Joule-Thomson refrigeration can provide the necessary wafer temperatures and cooling power with smaller footprint, better reliability and lower power consumption than alternative cooling technologies. Cryo-trapping can reduce particle generation by removing the water that mediates the particle formation process.
Lattice Expands CrossLink-NX FPGA Family of Best-in-Class Low Power FPGAs for Smart and Embedded Vision Systems
CrossLink-NX FPGAs deliver the best-in-class low power consumption, small form factor, reliability, and performance that developers need to create innovative embedded vision and AI solutions for compute, industrial, automotive, and consumer markets.
CEA-Leti X-Ray Photon-Counting Detector Modules Target Improved Medical Diagnoses
A novel X-ray photon-counting detector module (PCDM) developed by CEA-Leti and integrated in an X-ray scanner prototype from Siemens Healthineers has shown in clinical trials the potential to revolutionize computed-tomography (CT) scanning by potentially increasing spatial resolution, reducing X-ray exposure to patients, improving image quality by lowering image noise and artifacts, and by distinguishing multiple contrast agents.
