Strategy Analytics today said that the new U.S. Government policy announced in May 2020 against Huawei threatens U.S. semiconductor industry exports, innovation, and global leadership.
Global AI Edge Chipset Revenue to Reach $51.9B by 2025, Driven by the Increasing Need for AI Inference at the Edge, According to Omdia
The need for artificial intelligence (AI) on edge devices has been realized and the race to design edge-optimized chipsets has begun. According to new research from Omdia, AI processing on the edge device circumvents privacy concerns while avoiding the bandwidth, latency, and cost concerns of cloud computing.
DSP Group Strengthens its Position in Rapidly Growing Headset Market with Acquisition of SoundChip SA
DSP Group, Inc., a leading global provider of wireless chipset solutions for converged communications, announced the acquisition of privately owned SoundChip SA, a leading supplier of active noise cancellation (ANC) technology, engineering services, design tools, and production-line test systems for headsets.
SEMI FlexTech Invites Proposals for Funding Flexible Hybrid Electronics Advancements
SEMI FlexTech today released a Request for Proposals (RFP) for advanced technology developments of flexible hybrid electronics (FHE) for sensors, power and other key electronic components.
Renesas Unveils RZ/V Microprocessor Series with Vision-Optimized Artificial Intelligence Accelerator
Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, today introduced the RZ/V series of microprocessors (MPUs), which features DRP-AI (Dynamically Reconfigurable Processor), Renesas’ exclusive vision-optimized artificial intelligence (AI) accelerator.
Xperi and Tower Semiconductor Announce New License for 3D Stacked Image Sensor Technology
Xperi Holding Corporation and Tower Semiconductor, a global leader in high-value analog semiconductor foundry solutions, today announced Tower’s license of Invensas ZiBond and DBI 3D semiconductor interconnect technologies.
StratEdge Expands Production Capacity of its RF Packaging Line
StratEdge Corporation announces the expansion of its production line for building ceramic and molded ceramic packages to support 5G infrastructure demands.
SUSS MicroTec and micro resist technology GmbH Partner in Advancing Nanoimprint Lithography
SUSS MicroTec, leading supplier of equipment and process solutions for the semiconductor industry, and micro resist technology GmbH, a leading company for the development and production of innovative photoresists and advanced nanoimprint materials, announced today their cooperation on Nanoimprint Lithography (NIL).
STMicroelectronics’ Reference Design Enables Compact and Cost-Effective Wearables with Social-Distancing, Contact-Tracing, and Remote Capabilities
STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, announces the availability of a compact and cost-effective reference design ideally suited for monitoring social distancing, assuring remote operation, provisioning, as well as warning, anti-tampering, and potentially providing contact tracing to protect human health in all environments, including in response to global or local pandemic conditions.
Engineers Put Tens of Thousands of Artificial Brain Synapses on a Single Chip
MIT engineers have designed a “brain-on-a-chip,” smaller than a piece of confetti, that is made from tens of thousands of artificial brain synapses known as memristors — silicon-based components that mimic the information-transmitting synapses in the human brain.
