Digital cameras as well as many other electronic devices need light-sensitive sensors. In order to cater for the increasing demand for optoelectronic components of this kind, industry is searching for new semiconductor materials. A hybrid material, developed in Dresden, fulfils both these requirements. Himani Arora, a physics PhD student at Helmholtz-Zentrum Dresden-Rossendorf (HZDR), demonstrated that this metal-organic framework can be used as a broadband photodetector.
AMOLED Smartphone Panel Market Defies the Coronavirus Crisis, with 9 Percent Shipment Growth Expected in 2020
Despite a projected double-digit decline in smartphone shipments due to the coronavirus pandemic, the global market for active-matrix organic light-emitting diode (AMOLED) smartphone displays is expected to rise by 9 percent in 2020, according to Omdia.
Plasma-Therm Launches New Facility in the United Kingdom
Plasma-Therm, LLC a leading manufacturer of plasma-process equipment for the semiconductor industry, is pleased to announce the opening of its Specialty Process Engineering Group facility in Somerset, England.
MEMS at the Forefront of SARS-CoV-2 Testing
On Saturday, March, 21, 2020 the U.S. Food and Drug Administration (FDA) gave emergency authorization to Cepheid, a California company, to sell a new test for rapid detection of the pandemic coronavirus SARS-CoV-2, which causes COVID-19. Cepheid’s Xpert® Xpress SARS-CoV-2 test gives healthcare workers results in just 45 minutes, with less than a minute of hands-on time for sample preparation.
Eindhoven Researchers Present Revolutionary Light-Emitting Silicon
Emitting light from silicon has been the ‘Holy Grail’ in the microelectronics industry for decades. Solving this puzzle would revolutionize computing, as chips will become faster than ever. Researchers from Eindhoven University of Technology now succeeded: they have developed an alloy with silicon that can emit light. The results have been published in the journal Nature. The team will now start creating a silicon laser to be integrated into current chips.
Camtek Receives $8 Million Order for Multiple Inspection Systems From a Tier-1 Global CMOS Image Sensor Manufacturer
Camtek Ltd. (NASDAQ: CAMT) (TASE: CAMT), today announced that it received an order for multiple EagleT-i systems, its advanced inspection system, from a tier-one global CMOS Image Sensor manufacturer, totaling $8 million. The systems are expected to be delivered during the second and the third quarters of 2020.
Valens Semiconductor Announces New CEO and New Chairman of Its Board of Directors
Valens, the developer of high-speed connectivity technology for the audio-video and automotive markets, and its Board of Directors announced today that Dr. Peter Mertens has been appointed Chairman of the Board of Directors. Gideon Ben-Zvi, who has been the company’s Interim CEO since February 2020, has now been appointed as the company’s official CEO.
Cypress Unveils IoT-AdvantEdge Solutions Providing Developers a Trusted Design Path to IoT Edge Products
Cypress Semiconductor Corp. (NASDAQ: CY) today unveiled solutions that give IoT product developers a simplified path to build high-quality, secure, and reliable IoT products. The solutions, branded IoT-AdvantEdge™, include connectivity devices and microcontrollers, software, tools and support, and capabilities from ecosystem partners to slash development complexity by solving critical IoT product design problems.
Tachyum Opens New European Union Headquarters in Slovakia
Semiconductor startup Tachyum Inc. today announced that it has opened new offices in Slovakia that will enable it to best address the regional needs of its growing number of customers, partners, vendors and personnel throughout the European Union. Tachyum’s worldwide headquarters remain located in Silicon Valley.
CEVA Announces Industry’s First High Performance Sensor Hub DSP Architecture
CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies, today announced SensPro, the industry’s first high performance sensor hub DSP architecture designed to handle the broad range of sensor processing and sensor fusion workloads for contextually-aware devices.
