Sensera Limited (ASX: SE1, “Sensera”), an Internet of Things (IoT) solution provider, today announced that it has signed a worldwide distribution agreement with Braemac. Braemac’s global footprint and strong presence in the entire Pacific Rim region and especially Australia will further extend Sensera’s market coverage.
TopLine Awarded US Patent for CCGA Fixture
TopLine Corporation announced today that Martin Hart, CEO of TopLine and inventor, has been awarded US Patent D874,413 S for a fixture designed to deliver 1752 solder columns onto a substrate as part of the Ceramic Column Grid Array (CCGA) assembly process. The patent was awarded on February 4, 2020.
MagnaChip Semiconductor Announces CFO Transition
MagnaChip Semiconductor Corporation (“MagnaChip” or the “Company”) (NYSE: MX) today announced that Jonathan Kim, MagnaChip’s Chief Financial Officer, Executive Vice President and Chief Accounting Officer, is stepping down effective March 27, 2020 to pursue an executive opportunity outside of the semiconductor industry.
Keysight Works with Qualcomm Technologies to Accelerate Small Cell Deployment Supported by 5G vRAN Architecture
Keysight Technologies, Inc., a leading technology company that helps enterprises, service providers, and governments accelerate innovation to connect and secure the world, announced that Qualcomm Technologies, Inc., a wholly owned subsidiary of Qualcomm Incorporated, is working with the company to accelerate small cell deployment supported by 5G virtualized radio access network (vRAN) architecture.
EV Group Establishes Heterogenous Integration Competence Center
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has established the Heterogeneous Integration Competence Center™, which is designed to assist customers in leveraging EVG’s process solutions and expertise to enable new and enhanced products and applications driven by advances in system integration and packaging.
Scientists Succeed in Measuring Electron Spin Qubit Without Demolishing It
A group of scientists from the RIKEN Center for Emergent Matter Science in Japan have succeeded in taking repeated measurements of the spin of an electron in a silicon quantum dot (QD), without changing the spin in the process. This type of “non-demolition” measurement is important for creating quantum computers that are fault tolerant.
Unique Material Could Unlock New Functionality in Semiconductors
If new and promising semiconductor materials are to make it into our phones, computers, and other increasingly capable electronics, researchers must obtain greater control over how those materials function. Rensselaer Polytechnic Institute researchers detailed how they designed and synthesized a unique material with controllable capabilities that make it very promising for future electronics.
Picosun Delivers Multiple Production ALD Systems to Asia for Solid State Lighting Device Manufacturing
Picosun Group, Finland-based, global provider of advanced Atomic Layer Deposition (ALD) thin film coating solutions, has been chosen by a major Asian customer to deliver significant ALD production capacity for manufacturing of solid state lighting devices.
Stress-Relief Substrate Helps OLED Stretch Two-Dimensionally?
Highly functional and free-form displays are critical components to complete the technological prowess of wearable electronics, robotics, and human-machine interfaces. A KAIST team created stretchable OLEDs (Organic Light-Emitting Diodes) that are compliant and maintain their performance under high-strain deformation. Their stress-relief substrates have a unique structure and utilize pillar arrays to reduce the stress on the active areas of devices when strain is applied.
JEDEC Wide Bandgap Power Semiconductor Committee Publishes Guideline for Switching Reliability Evaluation Procedures for GaN Devices
JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, announces the publication of JEP180: Guideline for Switching Reliability Evaluation Procedures for Gallium Nitride Power Conversion Devices. Developed by JEDEC’s JC-70 Committee for Wide Bandgap Power Electronic Conversion Semiconductors, JEP180 is available for free download from the JEDEC website.
