D2S, a supplier of GPU-accelerated solutions for semiconductor manufacturing, today announced that its TrueMask® WPA (Wafer Plane Analysis) solution — a GPU-accelerated aerial simulation tool that integrates with mask CD-SEM systems to provide fast, highly accurate and highly repeatable CD metrology for complex and curvilinear mask shapes — has been extended for use with EUV photomasks.
Cartesiam AI Development Environment Brings Artificial Intelligence, Learning and Inference to Everyday Objects
Cartesiam, a company that creates artificial intelligence (AI) software for embedded systems, today announced at the Embedded World conference the availability of NanoEdge™ AI Studio, the first integrated development environment (IDE) that enables machine learning and inference directly on Arm Cortex-M microcontrollers (MCUs).
Micron joins eBeam Initiative
The eBeam Initiative, a forum dedicated to the education and promotion of new semiconductor manufacturing approaches based on electron beam (eBeam) technologies, today announced that Micron has joined the eBeam Initiative. As an industry leader in memory and storage solutions, Micron will provide a unique and important perspective to the educational activities of the eBeam Initiative within the semiconductor photomask and lithography supply chain.
Prophesee and Sony Develop a Stacked Event-Based Vision Sensor
The new sensor and its performance results were announced at the International Solid-State Circuits Conference (ISSCC) held in San Francisco in the United States, starting on February 16, 2020. The new stacked Event-based vision sensor detects changes in the luminance of each pixel asynchronously and outputs data including coordinates and time only for the pixels where a change is detected, thereby enabling high efficiency, high speed, low latency data output. This vision sensor achieves high resolution, high speed, and high time resolution despite its small size and low power consumption.
GlobalSign and Infineon Combine Forces to Strengthen IoT Device Identity
GMO GlobalSign (www.globalsign.com), a global Certificate Authority (CA) and leading provider of identity and security solutions for the Internet of Things (IoT), and semiconductor manufacturer Infineon Technologies AG, today announced a solution that secures, simplifies, and streamlines device enrollment into Microsoft Azure IoT Hub and IoT Hub Device Provisioning Service. The collaboration eases complex device identity integration challenges and delivers a proven path for IoT device security literally from chip to cloud.
IAR Systems Extends Arm Tools Offering With Support for Renesas Electronics’ RA Family
Today, IAR Systems® announces full coverage for the RA Arm® Cortex® microcontrollers (MCUs) from Renesas Electronics Corporation. The complete development toolchain IAR Embedded Workbench® provides powerful code optimizations and comprehensive debugging features in an easy-to-use integrated development environment with excellent worldwide technical support and training.
MagnaChip Launches New MOSFET to Enhance Protection for Wireless Earphones While Recharging
MagnaChip Semiconductor Corporation (“MagnaChip” or the “Company”) (NYSE: MX), a designer and manufacturer of analog and mixed-signal semiconductor products, announced today the company is entering the wireless earphone market with the introduction of a new MOSFET for wireless earphones for preventing the battery from overcharging. This MOSFET is designed to control excessive current flowing into wireless earphones while recharging the battery in order to protect wireless earphones from being damaged.
Advanced Semiconductor Manufacturing Strategies in AI Era to Highlight ASMC 2020
Covering topics from yield management to metrology in the era of artificial intelligence (AI), more than 100 industry experts will deliver 35 hours of technical presentations on the latest advanced semiconductor manufacturing strategies and methodologies at SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2020), May 4-7, 2020, in Saratoga Springs, New York. Registration is now open.
Roger Grace Announces Call for Abstracts
Roger Grace, President of Roger Grace Associates, the leading marketing consultancy specializing in Sensors and MEMS, has announced the call for abstracts for the all-day June 22, 2020 Pre-Conference Symposium during Sensors Expo & Conference, taking place at the McEnery Convention Center in San Jose, CA. Interested presenters are requested to submit abstracts of between 150-200 words as attached documents no later than March 16, 2020 and sent to Roger Grace, Symposium Chair, at rgrace@rgrace.com.
FLEX and MSTC 2020 Open Today as Flexible Hybrid Electronics Drive Next Wave of Smart MEMS and Sensors
The latest advances in flexible and printed electronics take the spotlight at the co-located Flexible Hybrid Electronics Conference and Exhibition (FLEX) and MEMS & Sensors Technical Congress (MSTC) opening today. FLEX and MSTC 2020 feature keynotes, panels, technical sessions, deep-dive tech talks, networking opportunities and nearly 50 exhibitors with more than 400 attendees. See the full agenda for the four-day events are at the DoubleTree by Hilton Hotel in San Jose, California.
