Universal Display Corporation, enabling energy-efficient displays and lighting with its UniversalPHOLED technology and materials, and Eternal Material Technology Company (EMT), ISO certified Chinese OLED materials supplier, today announced a strategic OLED host partnership.
Molex Celebrates Opening of Optical R&D Facility in New Jersey
Center for Excellence in Wavelength Selective Switches for telecommunications and other high-performance networks.
New Way to Make Micro-Sensors May Revolutionize Future of Electronics
Study may lead to better, cheaper microphones, gyroscopes, pressure sensors.
AKHAN Semiconductor, Inc. Issued Key Patent in Korea
Patent covers method for fabrication of diamond semiconductor materials.
The World’s First 5nm Generation AI Chip is Taped Out
TeraPixel Technologies Inc. taped out “Extrixa Processor” as the first deep-learning AI product on March 8, 2019 as the world’s first chip that uses TSMC 5nm.
Trymax Receives Order from a Leading-Edge Photonics Research Organization
Eindhoven University of Technology (TU/e) acquires a plasma solution from Trymax.
2019 IEEE International Electron Devices Meeting to Highlight Innovative Devices for an Era of Connected Intelligence
The upcoming 65th annual IEEE International Electron Devices Meeting (IEDM), to be held December 7-11, 2019 at the Hilton San Francisco Union Square hotel, will once again feature the latest and most important research taking place in semiconductors and other electron devices, but with a sharper focus this year on devices intended to support diverse new applications.
Arm TechCon 2019: Showcasing the New Era of Total Compute
Now in its 15th year, Arm® TechCon 2019, will explore three emergent technologies, AI, 5G, and a secure IoT, all of which are converging to enable more meaningful data insights and fuel a shift into the New Era of Total Compute.
3D Optical Sensing Ready for Prime Time
The 3D optical sensing market is once again surging – and it’s all thanks to Apple. What will we see in the next wave of end products enhanced by this technology, how will other market segments approach – and eventually use – 3D optical sensing, and which suppliers stand to gain the most from this very vital technology?
SIA Statement Following Commerce’s Announcement to Extend the Temporary General License
The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing, design, and research, today released the following statement from SIA President & CEO John Neuffer following the Department of Commerce announcement adding Huawei affiliates to the entities list and providing an extension of the Temporary General License until November 2019.
