Rise in demand for ultra-thin wafers, increase in need for wafer fabrication, surge in in focus toward wafer surface protection during grinding process, and high-end development in the semiconductor industry propel the growth of the global wafer backgrinding tape market.
Synthesizing Single-Crystalline Hexagonal Graphene Quantum Dots
A KAIST team has designed a novel strategy for synthesizing single-crystalline graphene quantum dots, which emit stable blue light.
Experimental Observation of a New Class of Materials: Excitonic Insulators
Scientists make first observation of an ‘excitonic insulator’, an exotic state first predicted in 1960s.
Sage Microelectronics and Everspin Partner to Bring Spin-transfer Torque MRAM to Next Generation Enterprise SSD Devices
Everspin Technologies, Inc., a developer and manufacturer of Magnetoresistive RAM (MRAM) persistent memory solutions, announced its partnership with Sage Microelectronics Corporation.
Silvaco Appoints Babak Taheri as New Chief Executive Officer
Company promotes CTO and EVP of Products, Dr. Babak Taheri to be Chief Executive Officer.
SEMI Urges Restraint by Japan and Korea in Light of Recent Trade Actions
On July 1st, Japan’s Ministry of Economy, Trade and Industry (METI) announced updated licensing policies and procedures on the export and transfer of controlled items and their relevant technologies to the Republic of Korea (ROK). METI’s stated purpose for the actions were “in order to ensure appropriate implementation of export control.”
MagnaChip Surpasses the 500 Million Milestone in Cumulative Shipments of Display Driver ICs for OLED Screens
Company was first to begin mass production of OLED DDICs in 2007 and continues to innovate.
Silicon Technologies Awarded Contract with US Government for Next Generation Radiation Hardened Electronics IP
Silicon Technologies Inc (STI) today announced winning a two-year contract with the Government to develop Radiation Hardened by Design (RHBD), Process Portable, Mixed Signal Design IP.
Kalray Announces the Tape-out of Coolidge on TSMC 16nm Process Technology
Kalray today announced the tape-out of MPPA3 aka Coolidge, its third generation of unique and patented MPPA processor family, on TSMC 16nm FinFET process technology.
