How Etch Breakthroughs Are Tackling 3D NAND Scaling Challenges on the Path to 1,000 Layers

As the industry now looks towards the 1,000-layer roadmap by the end of decade or soon thereafter, there are some critical challenges. Lam is working actively with leading customers to address these in time through innovations in etch, as well as other advanced manufacturing processing steps.

Power SiC WFE Market: Yole Group Forecasts the CapEx Trend

With multiple investments announced by players, the Power SiC wafer front-end equipment market will peak at $5 billion in 2026. Besides the strong growth in the tool market, there are some concerns about future over-capacity and manufacturing challenges for technology transition.

New Processes and Priorities Pose New SubFab Challenges

New process trends are creating new challenges for the equipment in the subfab, particularly vacuum pumps and gas abatements systems that must now handle new types of materials and their process byproducts, and at greater volumes

Wafer Fab Equipment: 2024 Revenue Holds Steady, Poised for 2025 Surge

Yole Group announces a 2024 revenue (calendar year) to increase by 1.3% year-on-year, reaching $108.1 billion, despite a 12% quarter-to-quarter drop in Q1 2024.

Optimizing Risk Mitigation in the Fab and Sub-Fab

Service is starting to come into the risk mitigation category, said Alex Smith, Vice President of Marketing, Semiconductor Service at Edwards.

KLA: 40 Years of Broadband Plasma Inspection

Broadband plasma inspectors use advanced optical and data processing technologies to discover critical defects on patterned wafers during chip manufacturing.

Bechtel: Now Is the Time for Digital Integration

We recently caught up with Dr. Evann Smith, the digital solutions manager for Bechtel’s Manufacturing & Technology business unit where they lead the strategic development and deployment of the digital ecosystem.

Edwards: How Cryogenics and High-Speed Vacuum Pumps Enable High Aspect Ratio Etch

Edwards has a new cryogenic chiller called Polycold that provides cryogenic wafer chuck cooling. The company also announced a new line of turbopumps.

SCREEN Focuses on Sustainability, New Coat/Develop Track Systems

SCREEN offers a diverse range of systems, from its flagship models for 300mm wafers, offering high functionality and superior productivity for the cutting-edge device market, to 200mm and under models that handle wafers of various sizes and shapes for the IoT device market

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