…economics of lithography slow scaling. Moore’s Law had been on life support ever since the industry started needing Double-Patterning (DP) at 1/4-pitch of 193nm optical lithography. EUV lithography shows slow and steady progress in source and resist technologies, and ASML…
Moore’s Law is Dead – (Part 1) What?
…twice the number of components won’t appear on the next IC chip (Part 1 of 4) Gordon Moore always calls it “so-called Moore’s Law” when discussing his eponymous observation about IC scaling trends, and he has always acknowledged that it’s…
Three fundamental shifts
At The ConFab, IBM’s Gary Patton gave us three reasons to be very positive about the future of the semiconductor industry: an explosion of applications, the rise of big data and the need to analyze all that data.
The Rise of MEMS Sensors
Join us for a MEMS-focused webcast on Thursday, June 19th at 12:00pm Eastern time. Presenters will be Jay Esfandyari from STMicroelectronics and Simone Severi from imec.
The next big thing: IoT
The Internet of Things alone will surpass the PC, tablet and phone market combined by 2017.
GLOBALFOUNDRIES’ Kengeri to speak at The ConFab
Subramani Kengeri, Vice President, Advanced Technology Architecture at GLOBALFOUNDRIES will speak at The ConFab 2014 on the “techno-economics” of how the relatively small semiconductor industry ($350 billion or $0.35 trillion) is driving the $85 trillion gross world product (GWP).
Thoughts on MIG Conference Japan
I am finally over the jet lag and able to share my thoughts from MEMS Industry Group (MIG) Conference Japan, MIG’s inaugural conference in Asia that was held on April 24.
What’s new in the latest ITRS
The latest ITRS highlights 3D power scaling, system level integration and a new chapter on big data.
IITC: New Materials for Advanced Interconnects
The 17th annual International Interconnect Technology Conference (IITC) will be held May 21 – 23, 2014 in conjunction with the 31st Advanced Metallization Conference (AMC) at the Doubletree Hotel in San Jose, California.
Extreme Stress for Existing Foundry/Fabless Model
The increased performance and the rapid shift from traditional handsets to consumer computing device post a number of manufacturing and supply chain challenges for fabless chip makers. The scale of the challenges also creates an “extreme stress” for the existing foundry/fabless model to defend its excellence in this dynamic landscape. Qualcomm’s Dr. Roawen Chen will discuss headwinds and opportunities in a keynote talk at The ConFab.
