The semiconductor market will continue at a steady growth rate for the next several years. For a semiconductor company to achieve significant growth in this ultra-competitive environment, it needs to identify market opportunities and predict the future, in terms of…
The ConFab R&D Panel is Set
A panel session at The ConFab, to be held June 22-25 in Las Vegas, will focus on how the semiconductor industry can continue to innovate in an environment where lower revenue growth is combined with rising development costs and consolidation.
MEMS – Enter with Care
MEMS – enter with care. I think that will be my tagline for MEMS Industry Group’s third annual MEMS Executive Congress Europe 2014 recently held in Munich, Germany.
Webcast on 3D Integration/Advanced Packaging, Lithography
If you’ve been following the field of 3D integration for any time at all, then you’re familiar with Sitaram Arkalgud. He’ll be presenting on Thursday for a Solid State Technology webcast.
Qualcomm’s Dr. Roawen Chen to keynote at The ConFab
I’m delighted to report that Dr. Roawen Chen, Senior Vice Present of global operations at Qualcomm, has accepted our invitation to deliver the keynote talk at The ConFab, on Monday June 23rd.
Dr. Gary Patton to provide keynote at The ConFab
Dr. Gary Patton will provide the keynote talk at The ConFab on Tuesday, June 24th. Gary is Vice President of IBM’s Semiconductor Research and Development Center in East Fishkill, New York
Mission accomplished. Now what?
I haven’t toasted to cheap silicon for a while. Why? Because that mission has been accomplished.
Take the NCMS survey, but first figure out your nano position
I recommend taking the new survey out by the National Center for Manufacturing Sciences (NCMS) but you may first want to give some thought as to what is and what isn’t “nanotechnology.”
No technical barriers seen for 450mm
Paul Farrar, general manager of the G450C consortium, said early work has demonstrated good results and that he sees no real barriers to implementing 450mm wafers from a technical standpoint.
50 years ago: February 1964
In the February 1964 issue of Solid State Technology, Bell Laboratories described scientific advances that made possible a telephone cable system across the Atlantic Ocean. Features focused on GaAs IR emitters, tunnel diode amplifiers and ways to determine thermal resistance by flux plotting.
